Enhancement of mechanical properties and microstructure characteristics in laser transmission joining of C1100/glass weld through Taguchi GRA and PCA multi-response optimization

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Enhancement of mechanical properties and microstructure characteristics in laser transmission joining of C1100/glass weld through Taguchi GRA and PCA multi-response optimization | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Enhancement of mechanical properties and microstructure characteristics in laser transmission joining of C1100/glass weld through Taguchi GRA and PCA multi-response optimization Hoai Nguyen, Jeng-Rong Ho This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-8312371/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract This study thoroughly investigates the enhancement of mechanical properties and microstructural characteristics in C1100/glass welds utilizing an innovative transmission laser joining method. We introduce a sophisticated hybrid polishing technique that seamlessly combines mechanical and electrochemical polishing to achieve a uniform surface. By effectively removing micro-defects and contaminants from the copper plate prior to the glass welding process. Using a strategic combination of the Taguchi method, Grey Relational Analysis, and Principal Component Analysis, we have identified the optimal processing parameters. These expertly determined settings include a laser power of 16 W, a scanning speed of 30 mm/s, a focal plane position of -0.50 µm, and an average surface roughness of only 0.10 µm, demonstrating our dedication to achieving excellence in processing efficiency and quality. The optimized C1100/glass joint demonstrates remarkable characteristics, achieving a welding shear strength of 42.02 MPa that surpasses all previous studies. This significant improvement is particularly noteworthy, even though it reveals some indications of brittle fractures in the separated surface morphologies. The correlation between optimal weld zone, dimension, the expansion of keyhole zone, abundant eutectic Cu-O-SiO 2 compounds, and Cu +(2+) -O formation is linked to the resulting highest joining shear strength. This study convincingly demonstrates the capability of generating high-quality copper/glass welds with an affordable laser source, highlighting its significant potential for the production of effective heat dissipation substrates for semiconductors. Mechanical Engineering Optics/Lasers Materials Engineering Laser transmission joining C1100/glass weld Taguchi-GRA-PCA optimization hybrid polishing method Bonding shear strength Micro-nanostructure characteristics Full Text Additional Declarations The authors declare no competing interests. Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-8312371","acceptedTermsAndConditions":true,"allowDirectSubmit":true,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":557323275,"identity":"fea6fe03-e4c8-48af-a17c-f7de9b76983b","order_by":0,"name":"Hoai 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