Evaluation of triple-layer EMWS for internal and external EMI shielding on paired 6-GHz LNA package modules

Evaluation of triple-layer EMWS for internal and external EMI shielding on paired 6-GHz LNA package modules | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Evaluation of triple-layer EMWS for internal and external EMI shielding on paired 6-GHz LNA package modules Koyu Chinen, Ichiko Kinjo This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-8827439/v1 This work is licensed under a CC BY 4.0 License Status: Under Review Version 1 posted 11 You are reading this latest preprint version Abstract High-speed, highly sensitive devices are packaged in a shielded module against EMI. However, the highly reflective metals used to shield external incident EM power cause internal EMI through multiple reflections, and densely packed devices such as high-gain amplifiers and signal generators, as well as impedance mismatching in PCB design, radiate undesired EM power. In this study, the internal EMI was analyzed using in-situ measurements with paired 6 GHz-band 30 dB SiGe LNA modules incorporated in an ADC mold package. The measured S-parameter transmission coefficient, \((\rm{S_{21}})\) , revealed an extraordinary phenomenon due to resonant oscillation caused by multiple reflections of the radiated EM power from the LNA output, and \((\rm{S_{21}})\) fluctuations caused by radiated EM power from another LNA. The resonant oscillation frequency depended on the mechanical dimensions of the ADC package and on the metal lid reflectivity. The resonant oscillation phenomenon was theoretically analyzed using equations for the signal power and phase changes through multiple reflection passes. The authors designed a triple-layer EMWS/M/EMWS sheet with EM wave shielding (EMWS) and metal, and experimentally confirmed its complete effectiveness in shielding both internal and external EMI. EMWS sheet RF packaged module internal EMI in-situ EMI analysis iron powder S-parameter 6GHz LNA Full Text Additional Declarations No competing interests reported. Cite Share Download PDF Status: Under Review Version 1 posted Editorial decision: Revision requested 13 Apr, 2026 Reviews received at journal 18 Mar, 2026 Reviews received at journal 18 Mar, 2026 Reviewers agreed at journal 15 Mar, 2026 Reviewers agreed at journal 14 Mar, 2026 Reviewers agreed at journal 08 Mar, 2026 Reviewers agreed at journal 04 Mar, 2026 Reviewers invited by journal 26 Feb, 2026 Editor assigned by journal 11 Feb, 2026 Submission checks completed at journal 11 Feb, 2026 First submitted to journal 09 Feb, 2026 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-8827439","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":589573582,"identity":"e101a6ce-b443-44e9-b1d6-07de1a5e05fd","order_by":0,"name":"Koyu Chinen","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAA20lEQVRIiWNgGAWjYBACCQh1gAdIMD5gMJAjTQuzAYOBsQTRWkAEG5BDhBbJ9h4zCYaaOzLm7L3HqgsKDOoMDjA/fHQDjxZpnjNALcee8Vj2nEu7PcPAQMLgAJuxcQ4eLXISOWYSjA2HeQxu5Jjd5jH4A9TCwyZNnJb7b8yKecC2ENAijbCFx4yZKC2SPceKLRKOAbWcyTGWBmqRnHmYgF8kjjdvvPGh5rC9wfEzhp95/hjw8x1vfvgYnxYGBg4DhgRkvsJhvMpBgP0BKl++gaCWUTAKRsEoGGEAAHxVRFJlZYC7AAAAAElFTkSuQmCC","orcid":"","institution":"GLEX","correspondingAuthor":true,"prefix":"","firstName":"Koyu","middleName":"","lastName":"Chinen","suffix":""},{"id":589573589,"identity":"ce896293-501d-4dad-8a3d-4de320cef881","order_by":1,"name":"Ichiko Kinjo","email":"","orcid":"","institution":"National Institue of Technology, Okinawa College","correspondingAuthor":false,"prefix":"","firstName":"Ichiko","middleName":"","lastName":"Kinjo","suffix":""}],"badges":[],"createdAt":"2026-02-09 07:56:29","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-8827439/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-8827439/v1","draftVersion":[],"editorialEvents":[],"editorialNote":"","failedWorkflow":false,"files":[{"id":102962095,"identity":"6a208fa9-f08d-46b3-8065-d29bf40d3457","added_by":"auto","created_at":"2026-02-19 04:02:11","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":1120534,"visible":true,"origin":"","legend":"","description":"","filename":"snarticlechinen.pdf","url":"https://assets-eu.researchsquare.com/files/rs-8827439/v1_covered_b3e2ff07-24c0-4930-943b-a89eb8bdde57.pdf"}],"financialInterests":"No competing interests reported.","formattedTitle":"Evaluation of triple-layer EMWS for internal and external EMI shielding on paired 6-GHz LNA package modules","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":true,"hideJournal":false,"highlight":"","institution":"","isAcceptedByJournal":false,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":false,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"discover-electronics","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"","sideBox":"Learn more about [Discover Electronics](https://www.springer.com/journal/44291)","snPcode":"44291","submissionUrl":"https://submission.nature.com/new-submission/44291","title":"Discover Electronics","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"stoa","reportingPortfolio":"Discover Series","inReviewEnabled":true,"inReviewRevisionsEnabled":true},"keywords":"EMWS sheet, RF packaged module, internal EMI, in-situ EMI analysis, iron powder, S-parameter, 6GHz LNA","lastPublishedDoi":"10.21203/rs.3.rs-8827439/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-8827439/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eHigh-speed, highly sensitive devices are packaged in a shielded module against EMI. However, the highly reflective metals used to shield external incident EM power cause internal EMI through multiple reflections, and densely packed devices such as high-gain amplifiers and signal generators, as well as impedance mismatching in PCB design, radiate undesired EM power. In this study, the internal EMI was analyzed using in-situ measurements with paired 6 GHz-band 30 dB SiGe LNA modules incorporated in an ADC mold package. The measured S-parameter transmission coefficient, \u003cspan class=\"InlineEquation\"\u003e\u003cspan class=\"mathinline\"\u003e\\((\\rm{S_{21}})\\)\u003c/span\u003e\u003c/span\u003e, revealed an extraordinary phenomenon due to resonant oscillation caused by multiple reflections of the radiated EM power from the LNA output, and \u003cspan class=\"InlineEquation\"\u003e\u003cspan class=\"mathinline\"\u003e\\((\\rm{S_{21}})\\)\u003c/span\u003e\u003c/span\u003e fluctuations caused by radiated EM power from another LNA. The resonant oscillation frequency depended on the mechanical dimensions of the ADC package and on the metal lid reflectivity. The resonant oscillation phenomenon was theoretically analyzed using equations for the signal power and phase changes through multiple reflection passes. The authors designed a triple-layer EMWS/M/EMWS sheet with EM wave shielding (EMWS) and metal, and experimentally confirmed its complete effectiveness in shielding both internal and external EMI.\u003c/p\u003e","manuscriptTitle":"Evaluation of triple-layer EMWS for internal and external EMI shielding on paired 6-GHz LNA package modules","msid":"","msnumber":"","nonDraftVersions":[{"code":1,"date":"2026-02-12 07:52:53","doi":"10.21203/rs.3.rs-8827439/v1","editorialEvents":[{"type":"communityComments","content":0},{"type":"decision","content":"Revision requested","date":"2026-04-13T16:17:30+00:00","index":"","fulltext":""},{"type":"editorInvitedReview","content":"","date":"2026-03-18T21:39:16+00:00","index":"hide","fulltext":""},{"type":"editorInvitedReview","content":"","date":"2026-03-18T07:36:05+00:00","index":"hide","fulltext":""},{"type":"reviewerAgreed","content":"325934151291381387727739437228991738348","date":"2026-03-15T19:57:29+00:00","index":"hide","fulltext":""},{"type":"reviewerAgreed","content":"268461124619551874789901153628280933573","date":"2026-03-14T19:05:12+00:00","index":"hide","fulltext":""},{"type":"reviewerAgreed","content":"63136928785469892298545067442534483388","date":"2026-03-08T06:58:33+00:00","index":"hide","fulltext":""},{"type":"reviewerAgreed","content":"171805600355874809273096570113869008601","date":"2026-03-04T09:03:24+00:00","index":"hide","fulltext":""},{"type":"reviewersInvited","content":"","date":"2026-02-26T15:02:19+00:00","index":"","fulltext":""},{"type":"editorAssigned","content":"","date":"2026-02-11T11:23:06+00:00","index":"","fulltext":""},{"type":"checksComplete","content":"","date":"2026-02-11T11:20:54+00:00","index":"","fulltext":""},{"type":"submitted","content":"Discover Electronics","date":"2026-02-09T07:46:32+00:00","index":"","fulltext":""}],"status":"published","journal":{"display":true,"email":"[email protected]","identity":"discover-electronics","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"","sideBox":"Learn more about [Discover Electronics](https://www.springer.com/journal/44291)","snPcode":"44291","submissionUrl":"https://submission.nature.com/new-submission/44291","title":"Discover Electronics","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"stoa","reportingPortfolio":"Discover Series","inReviewEnabled":true,"inReviewRevisionsEnabled":true}}],"origin":"","ownerIdentity":"33b29dad-86d9-4236-b64b-478ab3b38c24","owner":[],"postedDate":"February 12th, 2026","published":true,"recentEditorialEvents":[],"rejectedJournal":[],"revision":"","amendment":"","status":"under-review","subjectAreas":[],"tags":[],"updatedAt":"2026-04-23T07:08:14+00:00","versionOfRecord":[],"versionCreatedAt":"2026-02-12 07:52:53","video":"","vorDoi":"","vorDoiUrl":"","workflowStages":[]},"version":"v1","identity":"rs-8827439","journalConfig":"researchsquare"},"__N_SSP":true},"page":"/article/[identity]/[[...version]]","query":{"redirect":"/article/rs-8827439","identity":"rs-8827439","version":["v1"]},"buildId":"XKTyCvWXoU3ODBz1xrDgd","isFallback":false,"isExperimentalCompile":false,"dynamicIds":[84888],"gssp":true,"scriptLoader":[]}