Poly(ether-ketone)/Silica Nanocomposites: Storage Modulus and Hardness

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Poly(ether-ketone)/Silica Nanocomposites: Storage Modulus and Hardness | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Poly(ether-ketone)/Silica Nanocomposites: Storage Modulus and Hardness Mandar Joshi, Akhilesh Goyal, Roshan Gadve, Gautam Upadhyay, RAJENDRA KUMAR GOYAL This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-4476700/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract Dynamic mechanical properties of the poly(ether-ketone) (PEK) based nanocomposites reinforced with 0–30 wt.% (0-20.2 vol.%) SiO 2 nanoparticles (20–40 nm) were investigated at 1 Hz over the temperature range of 30–250°C for the application in printed circuit boards/electronic substrates. It was found that uniform dispersion of SiO 2 nanoparticles in the PEK matrix resulted in significant increase in storage modulus and microhardness. The highest increase in storage modulus measured at 50 ℃ (glassy region) and 250 ℃ (rubbery region) was more than 100% and 250% than that of neat PEK, respectively. A linear relationship between the storage modulus and microhardness of the nanocomposites with a correlation factor (R 2 ) of 0.96 was obtained. The ratio of storage modulus to microhardness (E′/H) was ~ 0.09. The nanocomposites exhibited lower peak values of the tan δ than that of neat PEK. Scanning electron microscopy revealed good interfacial adhesion between the PEK matrix and the SiO 2 nanoparticles which was validated by Kubat parameter. The glass transition temperatures determined from the loss modulus and tan δ are slightly increased for the nanocomposites. However, differential scanning calorimetry could not detect glass transition temperature. Nanocomposites Electron microscopy Dynamic mechanical properties Microhardness Non-isothermal crystallization Electronic packaging Poly(ether-ketone) Full Text Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-4476700","acceptedTermsAndConditions":true,"allowDirectSubmit":true,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":311569136,"identity":"efd23218-798f-41a6-a581-ca7a9ac9a38d","order_by":0,"name":"Mandar Joshi","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Mandar","middleName":"","lastName":"Joshi","suffix":""},{"id":311569137,"identity":"e7ef1723-de7f-4bf3-805a-692f871107e0","order_by":1,"name":"Akhilesh Goyal","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Akhilesh","middleName":"","lastName":"Goyal","suffix":""},{"id":311569138,"identity":"7e6e3796-4f91-4f0b-b305-3c575ac5e7a8","order_by":2,"name":"Roshan Gadve","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Roshan","middleName":"","lastName":"Gadve","suffix":""},{"id":311569139,"identity":"2016d4e7-10bd-4793-8a03-9b29a23e0243","order_by":3,"name":"Gautam Upadhyay","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Gautam","middleName":"","lastName":"Upadhyay","suffix":""},{"id":311569140,"identity":"ea75eb67-9b69-4c83-81cd-7241bb3a43d9","order_by":4,"name":"RAJENDRA KUMAR GOYAL","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAA0ElEQVRIiWNgGAWjYDACHijND8QHwCxm4rQYMEg2ALUcIEmLwQG4NQSAec/xC0w3Kv7IG187e/DwBwY7eQZ2Xvw6Zc72FDDnnDEw3HY7LwHosGTDBma+BLxaJPh5Ephz2wwYt93OMQBqYU5gYOYxIELLPwP7zbPBWuqJ0MLbfoA5t8EgcYM0WMthIrTwnGE4nHPMOHkGyGFnDI4bthHWkv7wcU6NnG3/7BzjDxUV1fL8/GfwawFGDDhGoAComI2AeiBgf0BYzSgYBaNgFIxsAABRkkCMlxxVGgAAAABJRU5ErkJggg==","orcid":"https://orcid.org/0000-0001-7096-3468","institution":"Malaviya National Institute of Technology Jaipur","correspondingAuthor":true,"prefix":"","firstName":"RAJENDRA","middleName":"KUMAR","lastName":"GOYAL","suffix":""}],"badges":[],"createdAt":"2024-05-25 12:03:20","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-4476700/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-4476700/v1","draftVersion":[],"editorialEvents":[],"editorialNote":"","failedWorkflow":false,"files":[{"id":65731064,"identity":"8aeeed39-9a16-4387-9a0b-342fb44a4250","added_by":"auto","created_at":"2024-10-01 20:41:25","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":1002270,"visible":true,"origin":"","legend":"","description":"","filename":"Manuscript.pdf","url":"https://assets-eu.researchsquare.com/files/rs-4476700/v1_covered_9a3c4125-6692-43dc-8c47-4b402de0ccf9.pdf"}],"financialInterests":"","formattedTitle":"Poly(ether-ketone)/Silica Nanocomposites: Storage Modulus and Hardness","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":false,"hideJournal":true,"highlight":"","institution":"","isAcceptedByJournal":false,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":true,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"researchsquare","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":true,"externalIdentity":"","sideBox":"","snPcode":"","submissionUrl":"/submission","title":"Research Square","twitterHandle":"researchsquare","acdcEnabled":true,"dfaEnabled":false,"editorialSystem":"","reportingPortfolio":"","inReviewEnabled":false,"inReviewRevisionsEnabled":true},"keywords":"Nanocomposites, Electron microscopy, Dynamic mechanical properties, Microhardness, Non-isothermal crystallization, Electronic packaging, Poly(ether-ketone)","lastPublishedDoi":"10.21203/rs.3.rs-4476700/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-4476700/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eDynamic mechanical properties of the poly(ether-ketone) (PEK) based nanocomposites reinforced with 0\u0026ndash;30 wt.% (0-20.2 vol.%) SiO\u003csub\u003e2\u003c/sub\u003e nanoparticles (20\u0026ndash;40 nm) were investigated at 1 Hz over the temperature range of 30\u0026ndash;250\u0026deg;C for the application in printed circuit boards/electronic substrates. 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