Assessment of Sustainable and Machinable Performance Metrics of Monocrystalline Silicon Carbide Wafer with Electrophoretic Assisted Multi-Diamond Wire Sawing | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Assessment of Sustainable and Machinable Performance Metrics of Monocrystalline Silicon Carbide Wafer with Electrophoretic Assisted Multi-Diamond Wire Sawing Eyob Messele Sefene, Chao-Chang Arthur Chen, Yueh-Hsun Tsai, Ting-Huan Lai, and 1 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-4062840/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 19 May, 2024 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted 5 You are reading this latest preprint version Abstract The rapacious demand for energy in semiconductor wafer manufacturing industries has significant implications for global warming and wafer manufacturing costs. Assessing sustainability in the multi-diamond wire sawing (MDWS) process is crucial for reducing costs and mitigating environmental impacts. However, sustainability assessment integrated with machinability performance metrics in this process has not been investigated. This novel study extensively analyzes sustainability metrics such as processing time, energy consumption, carbon dioxide emission, machining cost, and machinability characteristics, including surface roughness, diamond wear rate, and sawing temperature in monocrystalline silicon carbide (mono-SiC) sawing process. Experiments were conducted using traditional MDWS (T-MDWS), reactive MDWS (R-MDWS), and electrophoretic-assisted reactive MDWS (ER-MDWS) coolants. An autoregressive integrated moving average (ARIMA) model were used to predict the overall energy consumption of the MDWS machine. Results showed significant improvements across various responses such as processing time, energy consumption, carbon dioxide emissions, machining cost, surface roughness, diamond wear rate, and sawing temperature, with reductions of 2.95%, 3.87%, 6.80%, 12.82%, 4.68%, 16.32%, and 4.39%, respectively. Furthermore, the ARIMA model results indicate that the total energy consumption prediction accuracy reaches 98.813%. The findings demonstrated that the ER-MDWS cooling strategy is well-suited for large-scale wafer production without compromising surface quality while minimizing environmental impact. Multi-diamond wire sawing Monocrystalline Silicon carbide Electrophoretic deposition Sustainability Machinability ARIMA Full Text Supplementary Files FinalGraphicalAbstract.pptx Suplementaryinformation.docx Cite Share Download PDF Status: Published Journal Publication published 19 May, 2024 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted Editorial decision: Minor Revisions Needed 05 Apr, 2024 Reviewers agreed at journal 20 Mar, 2024 Reviewers invited by journal 13 Mar, 2024 Editor assigned by journal 13 Mar, 2024 First submitted to journal 09 Mar, 2024 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-4062840","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":279240050,"identity":"f95a30fd-312c-4fb3-ae7a-1714eddc9f0d","order_by":0,"name":"Eyob Messele Sefene","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAA60lEQVRIiWNgGAWjYHACNgjF3v/xAZDi4SNaCw/PAWMDEM1GvBaJBDMJJEtxA36J5GMPf+bY5dszJKRVfs2xk2FjYH746AYeLZIz0tKNebclW/YwHDh2W3ZbMtBhbMbGOXi0GNzIMZNm3MZswMPY2HZbchszUAsPmzQ+LfZALZI/t9Ub8DAzsxVLbqsnrMVAIsdMgnfbYQMeNjY2xo/bDhPWInHmGcgvxw14zvAwA114nIeNmYBf+NtBIbat2oB9/hvGj0CGPT9788PH+LQwCCQg2Mw8YBKfcrA1BxBsxh+EVI+CUTAKRsGIBAAah0A2n8LBowAAAABJRU5ErkJggg==","orcid":"https://orcid.org/0000-0003-4660-6262","institution":"National Taiwan Institute of Technology: National Taiwan University of Science and Technology","correspondingAuthor":true,"prefix":"","firstName":"Eyob","middleName":"Messele","lastName":"Sefene","suffix":""},{"id":279240051,"identity":"cbb717cb-0aa1-4275-80d2-73d9a09f0ece","order_by":1,"name":"Chao-Chang Arthur Chen","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Chao-Chang","middleName":"Arthur","lastName":"Chen","suffix":""},{"id":279240052,"identity":"e6c9eedc-5065-4f6c-87fb-c3aaeb9b9cd8","order_by":2,"name":"Yueh-Hsun Tsai","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Yueh-Hsun","middleName":"","lastName":"Tsai","suffix":""},{"id":279240053,"identity":"e7f0d6af-13af-4cae-8e49-3d2bba669a17","order_by":3,"name":"Ting-Huan Lai","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Ting-Huan","middleName":"","lastName":"Lai","suffix":""},{"id":279240054,"identity":"28799472-3aa4-4af9-ae16-c31356280913","order_by":4,"name":"Ding-Xuan Huang","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Ding-Xuan","middleName":"","lastName":"Huang","suffix":""}],"badges":[],"createdAt":"2024-03-10 07:40:21","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-4062840/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-4062840/v1","draftVersion":[],"editorialEvents":[{"content":"https://doi.org/10.1007/s00170-024-13664-y","type":"published","date":"2024-05-19T18:47:15+00:00"}],"editorialNote":"","failedWorkflow":false,"files":[{"id":56738876,"identity":"40c4c164-f340-4963-90c3-063508062fec","added_by":"auto","created_at":"2024-05-19 18:47:27","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":2297606,"visible":true,"origin":"","legend":"","description":"","filename":"SustainabilityandMachinabilityAnalysisofMDWS1.pdf","url":"https://assets-eu.researchsquare.com/files/rs-4062840/v1_covered_9d5132ea-addd-4ef3-b1c3-b1149096e7d0.pdf"},{"id":52722901,"identity":"adb4d29e-4d36-40a8-ac84-b7ecd144e58f","added_by":"auto","created_at":"2024-03-15 02:21:12","extension":"pptx","order_by":21,"title":"","display":"","copyAsset":false,"role":"supplement","size":12581057,"visible":true,"origin":"","legend":"","description":"","filename":"FinalGraphicalAbstract.pptx","url":"https://assets-eu.researchsquare.com/files/rs-4062840/v1/b4e1f5a0a10898af5f341b99.pptx"},{"id":52722900,"identity":"a0143885-0a0f-4921-bf57-ad343a763708","added_by":"auto","created_at":"2024-03-15 02:21:11","extension":"docx","order_by":22,"title":"","display":"","copyAsset":false,"role":"supplement","size":795981,"visible":true,"origin":"","legend":"","description":"","filename":"Suplementaryinformation.docx","url":"https://assets-eu.researchsquare.com/files/rs-4062840/v1/afdac58825e5daff2f5900aa.docx"}],"financialInterests":"","formattedTitle":"Assessment of Sustainable and Machinable Performance Metrics of Monocrystalline Silicon Carbide Wafer with Electrophoretic Assisted Multi-Diamond Wire Sawing","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":false,"hideJournal":false,"highlight":"","institution":"","isAcceptedByJournal":true,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":false,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"
[email protected]","identity":"the-international-journal-of-advanced-manufacturing-technology","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"jamt","sideBox":"Learn more about [The International Journal of Advanced Manufacturing Technology](https://www.springer.com/journal/170)","snPcode":"170","submissionUrl":"https://submission.nature.com/new-submission/170/3","title":"The International Journal of Advanced Manufacturing Technology","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"em","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false},"keywords":"Multi-diamond wire sawing , Monocrystalline Silicon carbide , Electrophoretic deposition , Sustainability , Machinability , ARIMA","lastPublishedDoi":"10.21203/rs.3.rs-4062840/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-4062840/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"The rapacious demand for energy in semiconductor wafer manufacturing industries has significant implications for global warming and wafer manufacturing costs. Assessing sustainability in the multi-diamond wire sawing (MDWS) process is crucial for reducing costs and mitigating environmental impacts. However, sustainability assessment integrated with machinability performance metrics in this process has not been investigated. This novel study extensively analyzes sustainability metrics such as processing time, energy consumption, carbon dioxide emission, machining cost, and machinability characteristics, including surface roughness, diamond wear rate, and sawing temperature in monocrystalline silicon carbide (mono-SiC) sawing process. Experiments were conducted using traditional MDWS (T-MDWS), reactive MDWS (R-MDWS), and electrophoretic-assisted reactive MDWS (ER-MDWS) coolants. An autoregressive integrated moving average (ARIMA) model were used to predict the overall energy consumption of the MDWS machine. Results showed significant improvements across various responses such as processing time, energy consumption, carbon dioxide emissions, machining cost, surface roughness, diamond wear rate, and sawing temperature, with reductions of 2.95%, 3.87%, 6.80%, 12.82%, 4.68%, 16.32%, and 4.39%, respectively. Furthermore, the ARIMA model results indicate that the total energy consumption prediction accuracy reaches 98.813%. The findings demonstrated that the ER-MDWS cooling strategy is well-suited for large-scale wafer production without compromising surface quality while minimizing environmental impact.","manuscriptTitle":"Assessment of Sustainable and Machinable Performance Metrics of Monocrystalline Silicon Carbide Wafer with Electrophoretic Assisted Multi-Diamond Wire Sawing","msid":"","msnumber":"","nonDraftVersions":[{"code":1,"date":"2024-03-15 02:21:06","doi":"10.21203/rs.3.rs-4062840/v1","editorialEvents":[{"type":"communityComments","content":0},{"type":"decision","content":"Minor Revisions Needed","date":"2024-04-05T13:44:47+00:00","index":"","fulltext":""},{"type":"reviewerAgreed","content":"","date":"2024-03-20T09:29:52+00:00","index":0,"fulltext":""},{"type":"reviewersInvited","content":"","date":"2024-03-13T15:16:17+00:00","index":"","fulltext":""},{"type":"editorAssigned","content":"","date":"2024-03-13T04:00:18+00:00","index":"","fulltext":""},{"type":"submitted","content":"The International Journal of Advanced Manufacturing Technology","date":"2024-03-10T03:40:16+00:00","index":"","fulltext":""}],"status":"published","journal":{"display":true,"email":"
[email protected]","identity":"the-international-journal-of-advanced-manufacturing-technology","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"jamt","sideBox":"Learn more about [The International Journal of Advanced Manufacturing Technology](https://www.springer.com/journal/170)","snPcode":"170","submissionUrl":"https://submission.nature.com/new-submission/170/3","title":"The International Journal of Advanced Manufacturing Technology","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"em","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false}}],"origin":"","ownerIdentity":"20bd4156-33f4-4b02-85fb-d7e252190ad5","owner":[],"postedDate":"March 15th, 2024","published":true,"recentEditorialEvents":[],"rejectedJournal":[],"revision":"","amendment":"","status":"published-in-journal","subjectAreas":[],"tags":[],"updatedAt":"2024-05-19T18:47:15+00:00","versionOfRecord":{"articleIdentity":"rs-4062840","link":"https://doi.org/10.1007/s00170-024-13664-y","journal":{"identity":"the-international-journal-of-advanced-manufacturing-technology","isVorOnly":false,"title":"The International Journal of Advanced Manufacturing Technology"},"publishedOn":"2024-05-19 18:47:15","publishedOnDateReadable":"May 19th, 2024"},"versionCreatedAt":"2024-03-15 02:21:06","video":"","vorDoi":"10.1007/s00170-024-13664-y","vorDoiUrl":"https://doi.org/10.1007/s00170-024-13664-y","workflowStages":[]},"version":"v1","identity":"rs-4062840","journalConfig":"researchsquare"},"__N_SSP":true},"page":"/article/[identity]/[[...version]]","query":{"redirect":"/article/rs-4062840","identity":"rs-4062840","version":["v1"]},"buildId":"qtupq5eGEP_6zYnWcrvyt","isFallback":false,"isExperimentalCompile":false,"dynamicIds":[84888],"gssp":true,"scriptLoader":[]}
Text is read by the "Ask this paper" AI Q&A widget below.
Extraction quality varies by source — PMC NXML preserves structure
cleanly, OA-HTML may include some navigation residue, and OA-PDF can
have broken hyphenation. The publisher copy
(via DOI)
is the canonical version.