Preparation and optimization of capillary wick vapor chamber using copper paste based on capillary suspension

Preparation and optimization of capillary wick vapor chamber using copper paste based on capillary suspension | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Preparation and optimization of capillary wick vapor chamber using copper paste based on capillary suspension Zhi-qian YANG, Kai-xiang HU, Rong-song GE, Guo-qiang MA, Yi-zhan CHEN This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-6834804/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 06 Nov, 2025 Read the published version in Journal of Materials Science: Materials in Engineering → Version 1 posted You are reading this latest preprint version Abstract To address the overheating issues in high-power integrated circuits, This article introduces introduced a copper paste prepared based on the principle of capillary suspension and printed on the vapor chamber. Research has shown that the addition of secondary fluid significantly changes the rheological properties of the paste. These rheological properties further influence the "boat-shaped" structure of the wick within the flow channel region. The article uses the value of the capillary characteristic parameter (ΔP cap × K) to comprehensively consider capillary performance, with a maximum value of 1.349×10 -8 N, allowing the working fluid to overcome gravity and climb vertically 49 mm in just 5 seconds, demonstrating optimal comprehensive performance. The heat transfer test results of the vapor chamber show that the low starting power is 2W and the maximum heat transfer power is 7W. At maximum heat transfer power, the minimum temperature difference achieved is only 1.62°C, with a corresponding minimum thermal resistance of just 0.231°C/W, significantly outperforming pure copper plates of the same dimensions and thickness in heat transfer performance. This further demonstrates that the new copper electronic paste prepared based on capillary suspension possesses excellent application performance. Capillary suspension Copper paste Vapor chamber Wick structure Heat transfer Performance Full Text Cite Share Download PDF Status: Published Journal Publication published 06 Nov, 2025 Read the published version in Journal of Materials Science: Materials in Engineering → Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-6834804","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":469480649,"identity":"05b718d6-4bde-4921-a67a-ff938d09dbd4","order_by":0,"name":"Zhi-qian YANG","email":"","orcid":"","institution":"Wuyi University","correspondingAuthor":false,"prefix":"","firstName":"Zhi-qian","middleName":"","lastName":"YANG","suffix":""},{"id":469480650,"identity":"915b5126-9c0b-4634-a120-508dc6b48eff","order_by":1,"name":"Kai-xiang HU","email":"","orcid":"","institution":"Wuyi University","correspondingAuthor":false,"prefix":"","firstName":"Kai-xiang","middleName":"","lastName":"HU","suffix":""},{"id":469480651,"identity":"2e706ce6-a8df-4486-aeca-68ac62c1c314","order_by":2,"name":"Rong-song GE","email":"","orcid":"","institution":"Wuyi University","correspondingAuthor":false,"prefix":"","firstName":"Rong-song","middleName":"","lastName":"GE","suffix":""},{"id":469480652,"identity":"e81e2570-2883-4805-bc65-982299c9d10a","order_by":3,"name":"Guo-qiang MA","email":"","orcid":"","institution":"Wuyi University","correspondingAuthor":false,"prefix":"","firstName":"Guo-qiang","middleName":"","lastName":"MA","suffix":""},{"id":469480653,"identity":"1a242f94-ce0e-4dd5-828b-d448e789dcdc","order_by":4,"name":"Yi-zhan CHEN","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAA0ElEQVRIiWNgGAWjYDACZgY2EJUAZB048KGCNC1siQdnnCHOHpgWHuPDvC1EqDc4zv7swc8ddnn80j0fDvA2MMjzix0goOUwQ7ph75nkYsk5ZzcckNzBYDhzdgJBLcckeNsOJG64kbvhgOEZhgSD2wS1MLZJ/gVq2X8j58GBxDaitDCzSYNtkchhOHCQGC2Sh9nYpGXbkhNn3EgzONhwRoKwX/jOH38m+bbNLrF/RvLjz38qbOT5pQloUTiAypfArxwE5BsIqxkFo2AUjIKRDgANrUsLMRr2mwAAAABJRU5ErkJggg==","orcid":"https://orcid.org/0000-0003-1574-3352","institution":"Wuyi University","correspondingAuthor":true,"prefix":"","firstName":"Yi-zhan","middleName":"","lastName":"CHEN","suffix":""}],"badges":[],"createdAt":"2025-06-06 07:51:05","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-6834804/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-6834804/v1","draftVersion":[],"editorialEvents":[{"content":"https://doi.org/10.1186/s40712-025-00359-9","type":"published","date":"2025-11-06T15:57:19+00:00"}],"editorialNote":"","failedWorkflow":false,"files":[{"id":95563979,"identity":"d8087c6a-18ac-421a-9171-7310070c0656","added_by":"auto","created_at":"2025-11-10 16:05:43","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":1216642,"visible":true,"origin":"","legend":"","description":"","filename":"ManuscriptFile.pdf","url":"https://assets-eu.researchsquare.com/files/rs-6834804/v1_covered_2123ceb2-d554-4bbe-9a3a-66e24bdbd216.pdf"}],"financialInterests":"","formattedTitle":"Preparation and optimization of capillary wick vapor chamber using copper paste based on capillary suspension","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":false,"hideJournal":false,"highlight":"","institution":"","isAcceptedByJournal":true,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":true,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"researchsquare","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":true,"externalIdentity":"","sideBox":"","snPcode":"","submissionUrl":"/submission","title":"Research Square","twitterHandle":"researchsquare","acdcEnabled":true,"dfaEnabled":false,"editorialSystem":"","reportingPortfolio":"","inReviewEnabled":false,"inReviewRevisionsEnabled":true},"keywords":"Capillary suspension, Copper paste, Vapor chamber, Wick structure, Heat transfer Performance","lastPublishedDoi":"10.21203/rs.3.rs-6834804/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-6834804/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eTo address the overheating issues in high-power integrated circuits, This article introduces introduced a copper paste prepared based on the principle of capillary suspension and printed on the vapor chamber. Research has shown that the addition of secondary fluid significantly changes the rheological properties of the paste. These rheological properties further influence the \"boat-shaped\" structure of the wick within the flow channel region. The article uses the value of the capillary characteristic parameter (ΔP\u003csub\u003ecap\u003c/sub\u003e × K) to comprehensively consider capillary performance, with a maximum value of 1.349×10\u003csup\u003e-8\u003c/sup\u003e N, allowing the working fluid to overcome gravity and climb vertically 49 mm in just 5 seconds, demonstrating optimal comprehensive performance.\u0026nbsp; The heat transfer test results of the vapor chamber show that the low starting power is 2W and the maximum heat transfer power is 7W. At maximum heat transfer power, the minimum temperature difference achieved is only 1.62°C, with a corresponding minimum thermal resistance of just 0.231°C/W, significantly outperforming pure copper plates of the same dimensions and thickness in heat transfer performance. This further demonstrates that the new copper electronic paste prepared based on capillary suspension possesses excellent application performance.\u003c/p\u003e","manuscriptTitle":"Preparation and optimization of capillary wick vapor chamber using copper paste based on capillary suspension","msid":"","msnumber":"","nonDraftVersions":[{"code":1,"date":"2025-06-12 13:51:00","doi":"10.21203/rs.3.rs-6834804/v1","editorialEvents":[{"type":"communityComments","content":0}],"status":"published","journal":{"display":true,"email":"[email protected]","identity":"researchsquare","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":true,"externalIdentity":"","sideBox":"","snPcode":"","submissionUrl":"/submission","title":"Research Square","twitterHandle":"researchsquare","acdcEnabled":true,"dfaEnabled":false,"editorialSystem":"","reportingPortfolio":"","inReviewEnabled":false,"inReviewRevisionsEnabled":true}}],"origin":"","ownerIdentity":"36d8049e-810d-4d23-89d2-adc14cd07a00","owner":[],"postedDate":"June 12th, 2025","published":true,"recentEditorialEvents":[],"rejectedJournal":[],"revision":"","amendment":"","status":"published-in-journal","subjectAreas":[],"tags":[],"updatedAt":"2025-11-10T16:00:05+00:00","versionOfRecord":{"articleIdentity":"rs-6834804","link":"https://doi.org/10.1186/s40712-025-00359-9","journal":{"identity":"journal-of-materials-science-materials-in-engineering","isVorOnly":true,"title":"Journal of Materials Science: Materials in Engineering"},"publishedOn":"2025-11-06 15:57:19","publishedOnDateReadable":"November 6th, 2025"},"versionCreatedAt":"2025-06-12 13:51:00","video":"","vorDoi":"10.1186/s40712-025-00359-9","vorDoiUrl":"https://doi.org/10.1186/s40712-025-00359-9","workflowStages":[]},"version":"v1","identity":"rs-6834804","journalConfig":"researchsquare"},"__N_SSP":true},"page":"/article/[identity]/[[...version]]","query":{"redirect":"/article/rs-6834804","identity":"rs-6834804","version":["v1"]},"buildId":"8U1c8b4HqxoKbykW_rLl7","isFallback":false,"isExperimentalCompile":false,"dynamicIds":[84888],"gssp":true,"scriptLoader":[]}