Numerical analysis of influencing factors on wafer surface flatness in double-sided chemical mechanical polishing process

Numerical analysis of influencing factors on wafer surface flatness in double-sided chemical mechanical polishing process | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Numerical analysis of influencing factors on wafer surface flatness in double-sided chemical mechanical polishing process XianGang Wang, Yiran Liu, Wenjie Yu, Lei Zhu, Jiayu Chen, Jun Cao, and 1 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-4018959/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract Enhancing the levelness of the wafer surface can be achieved by increasing the homogeneity of the radial motion speed of the wafer surface in relation to the polishing pad. In order to analyze the effects of the inner and outer pin ring rotational speeds, the equipment structure size, and the upper and lower polishing pad rotational speeds on the uniformity of the radial velocity distribution of the wafer surface with respect to the polishing pads, kinematics equations of the wafer surface relative to the polishing pads were constructed based on the kinematics of the planetary wheel system. The wafer's motion state with respect to the polishing pad is composed of two processes: rotation and revolution. Rotation is the reason for the uneven radial distribution of the wafer's surface speed; The surface velocity of the wafer is optimally dispersed with respect to the polishing pad when the polishing pad's rotational speed equals that of the planetary wheel; Increasing the polishing pad speed can result in a more equal speed distribution in the direction of the wafer radius with respect to the pad when the ratio of the outer pin ring speed N4 to the inner pin ring speed N3 is less than 1; The velocity homogeneity of the wafer in the radius direction can be enhanced by increasing the eccentricity of the wafer with regard to the planetary wheel and the distance between the center of the planetary wheel and the inner pin ring. Double-sided chemical-mechanical polishing (DSP) Silicon wafers Flatness Mathematical modeling Velocity distribution uniformity Full Text Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-4018959","acceptedTermsAndConditions":true,"allowDirectSubmit":true,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":277622749,"identity":"384e4ac2-a750-45ef-b61f-d9ef03d8c836","order_by":0,"name":"XianGang 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