Effect of Ether Bond Number in Organic Solvents on the Corrosion Behavior of SnAg3.0Cu0.5 Solder Paste

Effect of Ether Bond Number in Organic Solvents on the Corrosion Behavior of SnAg3.0Cu0.5 Solder Paste | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Effect of Ether Bond Number in Organic Solvents on the Corrosion Behavior of SnAg3.0Cu0.5 Solder Paste xin Wu, guangxing hu, wenjia jing, pengju xing, xiyu sun, lanxin jia This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-8692724/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract This study elucidates the critical influence of ether bond count in organic solvents on the corrosion behavior of SnAg3.0Cu0.5 solder paste. Four structurally analogous solvents, containing zero to four ether bonds, were incorporated into otherwise identical flux formulations. Corrosivity was assessed through copper plate tests, weight loss measurements, and surface insulation resistance (SIR) under damp-heat conditions (40℃, 90–93% RH). Increasing the number of ether bonds elevates solvent boiling point, suppresses volatility during reflow, and results in greater post-soldering residue. Under humid conditions, these residues undergo oxidative degradation, generating carboxylic acids and aldehydes that significantly accelerate copper corrosion. Consequently, tetraethylene glycol dimethyl ether (four ether bonds) exhibited the highest corrosion rate (1.72%), whereas hexanediol (zero ether bonds) showed the lowest (0.28%). SIR values strongly correlated with corrosion severity, confirming that solvent molecular architecture directly governs electrical reliability. These findings provide a molecular design guideline: to ensure high reliability in electronics, the number of ether bonds in solder paste solvents should not exceed three. Organic solvent Solder paste Solder joint Corrosiveness Full Text Additional Declarations No competing interests reported. Supplementary Files S1.docx Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-8692724","acceptedTermsAndConditions":true,"allowDirectSubmit":true,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":584745463,"identity":"5e271daa-8e10-4ef2-b592-c490d7bf862f","order_by":0,"name":"xin Wu","email":"","orcid":"","institution":"yunnan Tin group （holding）company limited","correspondingAuthor":false,"prefix":"","firstName":"xin","middleName":"","lastName":"Wu","suffix":""},{"id":584745464,"identity":"a32267f0-1136-470d-8697-97f6adb343ad","order_by":1,"name":"guangxing 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Corrosiveness","lastPublishedDoi":"10.21203/rs.3.rs-8692724/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-8692724/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eThis study elucidates the critical influence of ether bond count in organic solvents on the corrosion behavior of SnAg3.0Cu0.5 solder paste. Four structurally analogous solvents, containing zero to four ether bonds, were incorporated into otherwise identical flux formulations. Corrosivity was assessed through copper plate tests, weight loss measurements, and surface insulation resistance (SIR) under damp-heat conditions (40℃, 90\u0026ndash;93% RH). Increasing the number of ether bonds elevates solvent boiling point, suppresses volatility during reflow, and results in greater post-soldering residue. Under humid conditions, these residues undergo oxidative degradation, generating carboxylic acids and aldehydes that significantly accelerate copper corrosion. Consequently, tetraethylene glycol dimethyl ether (four ether bonds) exhibited the highest corrosion rate (1.72%), whereas hexanediol (zero ether bonds) showed the lowest (0.28%). SIR values strongly correlated with corrosion severity, confirming that solvent molecular architecture directly governs electrical reliability. These findings provide a molecular design guideline: to ensure high reliability in electronics, the number of ether bonds in solder paste solvents should not exceed three.\u003c/p\u003e","manuscriptTitle":"Effect of Ether Bond Number in Organic Solvents on the Corrosion Behavior of SnAg3.0Cu0.5 Solder Paste","msid":"","msnumber":"","nonDraftVersions":[{"code":1,"date":"2026-02-04 23:26:33","doi":"10.21203/rs.3.rs-8692724/v1","editorialEvents":[{"type":"communityComments","content":0}],"status":"published","journal":{"display":true,"email":"[email protected]","identity":"researchsquare","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":true,"externalIdentity":"","sideBox":"","snPcode":"","submissionUrl":"/submission","title":"Research Square","twitterHandle":"researchsquare","acdcEnabled":true,"dfaEnabled":false,"editorialSystem":"","reportingPortfolio":"","inReviewEnabled":false,"inReviewRevisionsEnabled":true}}],"origin":"","ownerIdentity":"e0e841b8-d4a3-4a6f-a0c9-7428aacfc272","owner":[],"postedDate":"February 4th, 2026","published":true,"recentEditorialEvents":[],"rejectedJournal":[],"revision":"","amendment":"","status":"posted","subjectAreas":[],"tags":[],"updatedAt":"2026-03-25T00:54:23+00:00","versionOfRecord":[],"versionCreatedAt":"2026-02-04 23:26:33","video":"","vorDoi":"","vorDoiUrl":"","workflowStages":[]},"version":"v1","identity":"rs-8692724","journalConfig":"researchsquare"},"__N_SSP":true},"page":"/article/[identity]/[[...version]]","query":{"redirect":"/article/rs-8692724","identity":"rs-8692724","version":["v1"]},"buildId":"XKTyCvWXoU3ODBz1xrDgd","isFallback":false,"isExperimentalCompile":false,"dynamicIds":[84888],"gssp":true,"scriptLoader":[]}