A novel experimental approach to the evaluation of thermal expansion parameters of solid materials | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article A novel experimental approach to the evaluation of thermal expansion parameters of solid materials A. F. Altzoumailis, V. N. Kytopoulos This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-4790536/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract In this work a micromagnetic emission – aided experimental approach is presented by which the coefficients of thermal expansion (CTE) and related thermoplastics Young's as well as respective plastic moduli of various solids can optimally be evaluated. For this scope, certain well- established characteristics of stress (strain) – correlated ferromicromagnetic properties of Ni (nickel) material were used as basic- reference measuring parameters. In this context a well- determined Ni- based layer was produced by vapor deposition on the surface of tested substrate material. This layer in turn was utilized as a suitable sensor for its micromagnetic emission – response to stresses (strains) developed during simultaneous thermal cooling of Ni – layer and respective substrate. The substrate form of metallic oxides were prepared by suitable thermal oxidation treatment of the respective metal, where the desired quality and thickness of obtained oxide scale could be achieved with acceptable tolerance. As such, the reliability, versatility and conveniency of the proposed measuring technique was tested on the basis of titanium and nickel as well as three types of metallic oxides, i.e. MgO (magnesia) TiO 2 ( rutile) and Mn 3 O 4 (Hausmannite). This was possible by subjection of these materials to controlled thermal cooling procedure within given temperature ranges. In this way one can demonstrate that the obtained experimental data concerning the overall- average as well as instantaneous CTE of these materials are in reasonable agreement with those found in the related literature. It was also found that the order of magnitude of the evaluated thermoelastic and plastic moduli were also in reasonably agreement with data in the respective literature. It should, however, be mentioned that owing to the scarcity of detailed data on these parameters, a more systematic and reliable assessment of the obtained values could not be made. oxide coefficient thermal expansion strain stress modulus substrate Ni- layer temperature range Full Text Additional Declarations The authors declare no competing interests. Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. 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