Experimental investigation on thermal performance of vapour chamber for cooling of electronic applications

Experimental investigation on thermal performance of vapour chamber for cooling of electronic applications | Authorea try { document.documentElement.classList.add('js'); } catch (e) { } var _gaq = _gaq || []; _gaq.push(['_setAccount', 'G-8VDV14Y67G']); _gaq.push(['_trackPageview']); (function() { var ga = document.createElement('script'); ga.type = 'text/javascript'; ga.async = true; ga.src = ('https:' == document.location.protocol ? 'https://ssl' : 'http://www') + '.google-analytics.com/ga.js'; var s = document.getElementsByTagName('script')[0]; s.parentNode.insertBefore(ga, s); })(); Skip to main content Preprints Collections Wiley Open Research IET Open Research Ecological Society of Japan All Collections About About Authorea FAQs Contact Us Quick Search anywhere Search for preprint articles, keywords, etc. Search Search ADVANCED SEARCH SCROLL This is a preprint and has not been peer reviewed. Data may be preliminary. 17 July 2025 V1 Latest version Share on Experimental investigation on thermal performance of vapour chamber for cooling of electronic applications Authors : Nilesh Gaikwad [email protected] and Narendra Deore Authors Info & Affiliations https://doi.org/10.22541/au.175273574.48908715/v1 170 views 87 downloads Contents Abstract Supplementary Material Information & Authors Metrics & Citations View Options References Figures Tables Media Share Abstract jabbrv-ltwa-all.ldf jabbrv-ltwa-en.ldf Thermal management of electronic devices is crucial, as the demand for more power in compact spaces has brought many challenges. Phase change devices like heat pipes/vapor chambers (VC) are the way forward due to their excellent heat transfer capability across slight temperature differences. The 3 mm thickness vapour chamber developed in this work addresses this issue by incorporating the design modifications inside the VC, like the arrangement of the sintered powder wick-covered pillar, which ensures structural reliability, the condensate return and wickless condenser, which reduces the overall thermal resistance. The VC charges distilled water (2 cm 3 ) as the working fluid and tests it for varying heat input. The results show that VC outperforms the copper (Cu) plate as a heat spreader with 60% less thermal resistance, and the thermal resistance ratio (Cu/VC) is 2.51 for 60 W heat input, effectively demonstrating the vapour chamber’s ability to spread heat. The maximum temperature rise on the evaporator surface is well below the copper plate, which reduces the local hot spot on the heat source, ensuring efficient heat transfer. Supplementary Material File (experimental investigation on thermal performance of vc for cooling of electronics applications.docx) Download 2.16 MB Information & Authors Information Version history V1 Version 1 17 July 2025 Copyright This work is licensed under a Non Exclusive No Reuse License. Keywords electronics cooling heat pipes heat sinks Authors Affiliations Nilesh Gaikwad [email protected] Pimpri Chinchwad Education Trust's Pimpri Chinchwad College of Engineering View all articles by this author Narendra Deore Pimpri Chinchwad Education Trust's Pimpri Chinchwad College of Engineering View all articles by this author Metrics & Citations Metrics Article Usage 170 views 87 downloads .FvxKWukQNSOunydq8rnd { width: 100px; } Citations Download citation Nilesh Gaikwad, Narendra Deore. Experimental investigation on thermal performance of vapour chamber for cooling of electronic applications. Authorea . 17 July 2025. DOI: https://doi.org/10.22541/au.175273574.48908715/v1 If you have the appropriate software installed, you can download article citation data to the citation manager of your choice. Simply select your manager software from the list below and click Download. For more information or tips please see 'Downloading to a citation manager' in the Help menu . Format Please select one from the list RIS (ProCite, Reference Manager) EndNote BibTex Medlars RefWorks Direct import Tips for downloading citations document.getElementById('citMgrHelpLink').addEventListener('click', function() { popupHelp(this.href); return false; }); $(".js__slcInclude").on("change", function(e){ if ($(this).val() == 'refworks') $('#direct').prop("checked", false); $('#direct').prop("disabled", ($(this).val() == 'refworks')); }); View Options View options PDF View PDF Figures Tables Media Share Share Share article link Copy Link Copied! Copying failed. 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