Chip removal mechanism and hole plugging in back-drilling of high-speed printed circuit board | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Chip removal mechanism and hole plugging in back-drilling of high-speed printed circuit board Zhuangpei Chen, Hongyan Shi, Tao Zhu, Xianwen Liu, Zhaoguo Wang, and 1 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-4021684/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 11 Mar, 2025 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted 5 You are reading this latest preprint version Abstract Micro-holes are channels for signal connection between layers of printed circuit boards (PCBs), and excess invalid hole copper in through holes can destroy the integrity of signal, which is usually removed by back-drilling. However, as high-speed PCBs evolve towards miniaturization and high density, it is difficult to remove chips during back-drilling and easily cause micro-holes plugging, seriously affecting the performance of high-speed PCBs and even leading to scrap. Therefore, the chip removal mechanism of high-speed PCB back-drilling is studied to solve hole plugging in this paper. Firstly, kinematics method is used to analyze the mechanical behavior and motion law of chip formation, and then the expressions of chip removal force and chip moving speed are proposed. Secondly, the chip removal model of backdrilling is established, an evaluation index of chip removal capability is put forward, and the influence rule of machining parameters on chip removal of back-drilling is analyzed afterwards. Finally, back-drilling experiments of high-speed PCB are carried out to observe the chips winding around drill bit and calculated the hole plugging rate of back-drilling. The experimental result demonstrates that the number and density of winding chips in the drill bit slightly decrease with the increase of feed rate, and the hole plugging rate rises almost proportionally. Increasing the spindle speed can greatly improve the chip winding of tools and hole plugging, and effectively reduce the chip removal force of back-drilling. The research presented provides theoretical guidance for solving the bottleneck problem of micro-holes plugging during backdrilling in the high-speed PCB industry. High-speed printed circuit board Micro-hole back-drilling Hole plugging Chip moving speed Chip Removal model Full Text Cite Share Download PDF Status: Published Journal Publication published 11 Mar, 2025 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted Editorial decision: Major Revisions Needed 20 Aug, 2024 Reviewers agreed at journal 20 Mar, 2024 Reviewers invited by journal 19 Mar, 2024 Editor assigned by journal 19 Mar, 2024 First submitted to journal 06 Mar, 2024 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-4021684","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":281297192,"identity":"6cd0c4cd-d467-4940-9010-27a074835791","order_by":0,"name":"Zhuangpei Chen","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Zhuangpei","middleName":"","lastName":"Chen","suffix":""},{"id":281297193,"identity":"d8d22327-6938-4e79-bb5a-b022e8df9091","order_by":1,"name":"Hongyan Shi","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAAvElEQVRIiWNgGAWjYDACCQjFw8/MfPgBSVpkJNvZ0gxI0mJjcJ5HQYIoHfKzewyYCyoYeIwP8zAYMNTYRBPUYnDnjAHzjDMMPGaHeQ88YDiWlttAUItEjvlv3jaQFr4EA8aGw4S1yM/IMWAGaTFu5jGQIEoLww2oFgNmYrUY3EgrYOY5I8EjcRgYyAnE+EV+RvIGZp4KG3v+/sOHH3yosSHCYQwcoAiExkgCYeUgwP6AOHWjYBSMglEwcgEANXIy5MF4J9MAAAAASUVORK5CYII=","orcid":"https://orcid.org/0000-0001-8318-3305","institution":"Shenzhen University","correspondingAuthor":true,"prefix":"","firstName":"Hongyan","middleName":"","lastName":"Shi","suffix":""},{"id":281297194,"identity":"f44074b3-06c2-446e-af64-2cd34d80cc1a","order_by":2,"name":"Tao Zhu","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Tao","middleName":"","lastName":"Zhu","suffix":""},{"id":281297195,"identity":"06ade42f-d136-40b6-84f8-66b1ff6b4313","order_by":3,"name":"Xianwen Liu","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Xianwen","middleName":"","lastName":"Liu","suffix":""},{"id":281297196,"identity":"b5bc2c69-baab-4368-95e3-feb00b019f7d","order_by":4,"name":"Zhaoguo Wang","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Zhaoguo","middleName":"","lastName":"Wang","suffix":""},{"id":281297197,"identity":"e1b625eb-d6bf-4c21-b426-b937067e55dc","order_by":5,"name":"Qian Zhou","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Qian","middleName":"","lastName":"Zhou","suffix":""}],"badges":[],"createdAt":"2024-03-06 16:03:20","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-4021684/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-4021684/v1","draftVersion":[],"editorialEvents":[{"content":"https://doi.org/10.1007/s00170-025-15321-4","type":"published","date":"2025-03-11T15:57:41+00:00"}],"editorialNote":"","failedWorkflow":false,"files":[{"id":78688982,"identity":"99de5a1b-4ce1-4e2b-9f01-82a9a70b8cd2","added_by":"auto","created_at":"2025-03-17 16:09:41","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":3784038,"visible":true,"origin":"","legend":"","description":"","filename":"Chipremovalmechanismandholeplugginginbackdrilling.pdf","url":"https://assets-eu.researchsquare.com/files/rs-4021684/v1_covered_b4be7268-5ba6-4f5f-91b5-09aabf2ebb36.pdf"}],"financialInterests":"","formattedTitle":"Chip removal mechanism and hole plugging in back-drilling of high-speed printed circuit board","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":false,"hideJournal":false,"highlight":"","institution":"","isAcceptedByJournal":true,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":false,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"
[email protected]","identity":"the-international-journal-of-advanced-manufacturing-technology","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"jamt","sideBox":"Learn more about [The International Journal of Advanced Manufacturing Technology](https://www.springer.com/journal/170)","snPcode":"170","submissionUrl":"https://submission.nature.com/new-submission/170/3","title":"The International Journal of Advanced Manufacturing Technology","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"em","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false},"keywords":"High-speed printed circuit board, Micro-hole back-drilling, Hole plugging, Chip moving speed, Chip Removal model","lastPublishedDoi":"10.21203/rs.3.rs-4021684/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-4021684/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"Micro-holes are channels for signal connection between layers of printed circuit boards (PCBs), and excess invalid hole copper in through holes can destroy the integrity of signal, which is usually removed by back-drilling. However, as high-speed PCBs evolve towards miniaturization and high density, it is difficult to remove chips during back-drilling and easily cause micro-holes plugging, seriously affecting the performance of high-speed PCBs and even leading to scrap. Therefore, the chip removal mechanism of high-speed PCB back-drilling is studied to solve hole plugging in this paper. Firstly, kinematics method is used to analyze the mechanical behavior and motion law of chip formation, and then the expressions of chip removal force and chip moving speed are proposed. Secondly, the chip removal model of backdrilling is established, an evaluation index of chip removal capability is put forward, and the influence rule of machining parameters on chip removal of back-drilling is analyzed afterwards. Finally, back-drilling experiments of high-speed PCB are carried out to observe the chips winding around drill bit and calculated the hole plugging rate of back-drilling. The experimental result demonstrates that the number and density of winding chips in the drill bit slightly decrease with the increase of feed rate, and the hole plugging rate rises almost proportionally. Increasing the spindle speed can greatly improve the chip winding of tools and hole plugging, and effectively reduce the chip removal force of back-drilling. The research presented provides theoretical guidance for solving the bottleneck problem of micro-holes plugging during backdrilling in the high-speed PCB industry.","manuscriptTitle":"Chip removal mechanism and hole plugging in back-drilling of high-speed printed circuit board","msid":"","msnumber":"","nonDraftVersions":[{"code":1,"date":"2024-03-21 03:40:10","doi":"10.21203/rs.3.rs-4021684/v1","editorialEvents":[{"type":"communityComments","content":0},{"type":"decision","content":"Major Revisions Needed","date":"2024-08-21T00:00:43+00:00","index":"","fulltext":""},{"type":"reviewerAgreed","content":"","date":"2024-03-20T06:34:37+00:00","index":0,"fulltext":""},{"type":"reviewersInvited","content":"","date":"2024-03-19T09:50:27+00:00","index":"","fulltext":""},{"type":"editorAssigned","content":"","date":"2024-03-19T06:03:51+00:00","index":"","fulltext":""},{"type":"submitted","content":"The International Journal of Advanced Manufacturing Technology","date":"2024-03-06T11:03:13+00:00","index":"","fulltext":""}],"status":"published","journal":{"display":true,"email":"
[email protected]","identity":"the-international-journal-of-advanced-manufacturing-technology","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"jamt","sideBox":"Learn more about [The International Journal of Advanced Manufacturing Technology](https://www.springer.com/journal/170)","snPcode":"170","submissionUrl":"https://submission.nature.com/new-submission/170/3","title":"The International Journal of Advanced Manufacturing Technology","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"em","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false}}],"origin":"","ownerIdentity":"e57f2b2a-bd9d-4f47-89c1-a5bcfaa6aa92","owner":[],"postedDate":"March 21st, 2024","published":true,"recentEditorialEvents":[],"rejectedJournal":[],"revision":"","amendment":"","status":"published-in-journal","subjectAreas":[],"tags":[],"updatedAt":"2025-03-17T16:01:57+00:00","versionOfRecord":{"articleIdentity":"rs-4021684","link":"https://doi.org/10.1007/s00170-025-15321-4","journal":{"identity":"the-international-journal-of-advanced-manufacturing-technology","isVorOnly":false,"title":"The International Journal of Advanced Manufacturing Technology"},"publishedOn":"2025-03-11 15:57:41","publishedOnDateReadable":"March 11th, 2025"},"versionCreatedAt":"2024-03-21 03:40:10","video":"","vorDoi":"10.1007/s00170-025-15321-4","vorDoiUrl":"https://doi.org/10.1007/s00170-025-15321-4","workflowStages":[]},"version":"v1","identity":"rs-4021684","journalConfig":"researchsquare"},"__N_SSP":true},"page":"/article/[identity]/[[...version]]","query":{"redirect":"/article/rs-4021684","identity":"rs-4021684","version":["v1"]},"buildId":"8U1c8b4HqxoKbykW_rLl7","isFallback":false,"isExperimentalCompile":false,"dynamicIds":[84888],"gssp":true,"scriptLoader":[]}
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