Chronopotentiometry driven electrodeposition of Cu- Ni-W thin films on ITO substrate: A comprehensive study of microstructure and corrosion behaviour

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Chronopotentiometry was used to deposit Cu-Ni-W thin films with face-centered cubic and NiW/Ni<sub>4</sub>W phases, where higher current densities produced smaller crystallites and better corrosion resistance.

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The study electrodeposited Cu-Ni-W thin films on ITO-coated glass using a galvanostatic chronopotentiogram method, varying current density from −5 to −60 mA/cm², and characterized resulting microstructure and corrosion behavior. X-ray diffraction showed a face-centered cubic structure with prominent (111), (200), and (220) planes, while additional peaks indicated NiW and Ni4W phases; higher current density produced smaller crystallite size (17 nm), greater texture coefficient (2.48), and up to ~16% micro-strain from peak broadening. The authors report that strong (111) texture and nano-crystallites coincided with an increased corrosion resistance, reaching 16.22 kΩ·cm² for the −60 mA/cm² condition. The paper’s limitation is that the provided content does not describe experimental corrosion testing details or broader characterization beyond XRD and the reported corrosion metric. This paper does not explicitly discuss endometriosis or adenomyosis; it was included in the corpus via a keyword match in the upstream search index.

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Abstract

Abstract Cu-Ni-W thin films are deposited by varying the current density from − 5 to -60 mA/cm² using the galvanostatic chronopotentiogram method on ITO-coated glass substrates. The X-ray diffraction (XRD) analysis revealed that Cu-Ni-W thin films exhibit a face-centered cubic structure with the presence of specific crystallographic planes, particularly (111), (200), and (220), at 2θ values of 43.4°, 50.7°, and 74.7°. The additional peaks observed at other 2θ values correspond to NiW and Ni4W phases. It is found that film deposited at higher current densities favor the growth of smaller crystalline size of 17 nm and higher degree of texture coefficient of 2.48. The maximum value of micro-strain of about 16% is calculated from the peak broadening of X-ray diffractograms. Due to the strong (111) texture and nano crystallites as confirmed by XRD resulted in an outstanding corrosion resistance of 16.22 kΩ cm² for the film deposited at -60 mA/cm².
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Chronopotentiometry driven electrodeposition of Cu- Ni-W thin films on ITO substrate: A comprehensive study of microstructure and corrosion behaviour | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Chronopotentiometry driven electrodeposition of Cu- Ni-W thin films on ITO substrate: A comprehensive study of microstructure and corrosion behaviour Himanshu Saini, Dr. Ravi Singh, Manvendra Singh Khatri This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-4349466/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract Cu-Ni-W thin films are deposited by varying the current density from − 5 to -60 mA/cm² using the galvanostatic chronopotentiogram method on ITO-coated glass substrates. The X-ray diffraction (XRD) analysis revealed that Cu-Ni-W thin films exhibit a face-centered cubic structure with the presence of specific crystallographic planes, particularly (111), (200), and (220), at 2 θ values of 43.4°, 50.7°, and 74.7°. The additional peaks observed at other 2θ values correspond to NiW and Ni 4 W phases. It is found that film deposited at higher current densities favor the growth of smaller crystalline size of 17 nm and higher degree of texture coefficient of 2.48. The maximum value of micro-strain of about 16% is calculated from the peak broadening of X-ray diffractograms. Due to the strong (111) texture and nano crystallites as confirmed by XRD resulted in an outstanding corrosion resistance of 16.22 kΩ cm² for the film deposited at -60 mA/cm². Electrodeposition X-Ray diffraction Texture Micro-strain Corrosion resistance Full Text Additional Declarations No competing interests reported. Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. 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