Enhancing Properties, Microstructure and Interfacial Reaction of SnBiIn Solder with Nickel-Coated Carbon Nanotubes

Enhancing Properties, Microstructure and Interfacial Reaction of SnBiIn Solder with Nickel-Coated Carbon Nanotubes | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Enhancing Properties, Microstructure and Interfacial Reaction of SnBiIn Solder with Nickel-Coated Carbon Nanotubes Zheng Liu, Yang Zheng, Yucong He, Yu Zhang, Yaocheng Zhang, Qixing Liu, and 1 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-7827944/v1 This work is licensed under a CC BY 4.0 License Status: Under Review Version 1 posted 5 You are reading this latest preprint version Abstract This paper systematically investigates the impact of nickel-coated carbon nanotubes (Ni-CNTs) on the melting behavior, wettability, microstructure, properties, and fracture characteristics of SnBiIn-based low-temperature solder. The growth kinetics of interfacial intermetallic compounds (IMCs) at SnBiIn-xNi-CNTs/Cu solder joints were also examined. Findings indicated that the addition of Ni-CNTs has a relatively minor influence on the melting point of the SnBiIn solder, with all recorded melting points remaining approximately 85°C. As the Ni-CNTs content increases, the solder wettability initially decreases and subsequently increases, achieving optimal performance at a content of 0.075 wt.%. At this time, the wetting angle is 29.8° and the spreading area is 79.0 mm 2 . The Ni-CNTs addition results in significant refinement of the solder microstructure. The minimum average width of the InBi phase, measuring 3.97 µm, was achieved at a Ni-CNTs content of 0.05 wt.%, beyond which a coarsening behavior was observed with increasing concentration. Correspondingly, the tensile strength of the solder exhibited an initial increase followed by a decrease, reaching its maximum value of 66.52 MPa at the optimal Ni-CNTs addition level of 0.05 wt.%. At the solder joint interface, the intermetallic compounds (IMCs) were identified to be composed primarily of Cu₆(Sn,In)₅ and Cu₃(Sn,In) phases.Ni-CNTs addition reduces the formation of prismatic Cu₆(Sn,In)₅ phases, while increasing the generation of scallop-shaped phases. Interfacial IMCs thickness exhibits a minimum (2.49 µm) at 0.075 wt.% Ni-CNTs. SnBiIn solder Ni-CNTs Microstructure refinement Interfacial reaction Full Text Cite Share Download PDF Status: Under Review Version 1 posted Reviewers agreed at journal 12 Dec, 2025 Reviewers invited by journal 07 Dec, 2025 Editor invited by journal 21 Oct, 2025 Editor assigned by journal 21 Oct, 2025 First submitted to journal 19 Oct, 2025 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-7827944","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":556461461,"identity":"957bb6ca-42ba-434b-a655-48f58a271852","order_by":0,"name":"Zheng Liu","email":"","orcid":"","institution":"Guilin University of Aerospace Technology","correspondingAuthor":false,"prefix":"","firstName":"Zheng","middleName":"","lastName":"Liu","suffix":""},{"id":556461462,"identity":"e2ce50bb-77fd-4ad9-a209-bf01fe14afe9","order_by":1,"name":"Yang Zheng","email":"","orcid":"","institution":"Shanghai Aerospace Electronic Technology 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Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false},"keywords":"SnBiIn solder, Ni-CNTs, Microstructure refinement, Interfacial reaction","lastPublishedDoi":"10.21203/rs.3.rs-7827944/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-7827944/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eThis paper systematically investigates the impact of nickel-coated carbon nanotubes (Ni-CNTs) on the melting behavior, wettability, microstructure, properties, and fracture characteristics of SnBiIn-based low-temperature solder. The growth kinetics of interfacial intermetallic compounds (IMCs) at SnBiIn-xNi-CNTs/Cu solder joints were also examined. Findings indicated that the addition of Ni-CNTs has a relatively minor influence on the melting point of the SnBiIn solder, with all recorded melting points remaining approximately 85\u0026deg;C. As the Ni-CNTs content increases, the solder wettability initially decreases and subsequently increases, achieving optimal performance at a content of 0.075 wt.%. At this time, the wetting angle is 29.8\u0026deg; and the spreading area is 79.0 mm\u003csup\u003e2\u003c/sup\u003e. The Ni-CNTs addition results in significant refinement of the solder microstructure. The minimum average width of the InBi phase, measuring 3.97 \u0026micro;m, was achieved at a Ni-CNTs content of 0.05 wt.%, beyond which a coarsening behavior was observed with increasing concentration. Correspondingly, the tensile strength of the solder exhibited an initial increase followed by a decrease, reaching its maximum value of 66.52 MPa at the optimal Ni-CNTs addition level of 0.05 wt.%. At the solder joint interface, the intermetallic compounds (IMCs) were identified to be composed primarily of Cu₆(Sn,In)₅ and Cu₃(Sn,In) phases.Ni-CNTs addition reduces the formation of prismatic Cu₆(Sn,In)₅ phases, while increasing the generation of scallop-shaped phases. Interfacial IMCs thickness exhibits a minimum (2.49 \u0026micro;m) at 0.075 wt.% Ni-CNTs.\u003c/p\u003e","manuscriptTitle":"Enhancing Properties, Microstructure and Interfacial Reaction of SnBiIn Solder with Nickel-Coated Carbon Nanotubes","msid":"","msnumber":"","nonDraftVersions":[{"code":1,"date":"2025-12-11 11:27:43","doi":"10.21203/rs.3.rs-7827944/v1","editorialEvents":[{"type":"communityComments","content":0},{"type":"reviewerAgreed","content":"","date":"2025-12-13T02:15:39+00:00","index":0,"fulltext":""},{"type":"reviewersInvited","content":"","date":"2025-12-07T11:58:16+00:00","index":"","fulltext":""},{"type":"editorInvited","content":"Welding in the World","date":"2025-10-21T18:47:39+00:00","index":"","fulltext":""},{"type":"editorAssigned","content":"","date":"2025-10-21T04:14:19+00:00","index":"","fulltext":""},{"type":"submitted","content":"Welding in the World","date":"2025-10-20T03:24:15+00:00","index":"","fulltext":""}],"status":"published","journal":{"display":true,"email":"[email protected]","identity":"welding-in-the-world","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"witw","sideBox":"Learn more about [Welding in the World](https://www.springer.com/journal/40194)","snPcode":"40194","submissionUrl":"https://www.editorialmanager.com/witw/","title":"Welding in the World","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"em","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false}}],"origin":"","ownerIdentity":"4462748e-3c37-4bae-aa87-746699e23900","owner":[],"postedDate":"December 11th, 2025","published":true,"recentEditorialEvents":[],"rejectedJournal":[],"revision":"","amendment":"","status":"under-review","subjectAreas":[],"tags":[],"updatedAt":"2026-04-03T17:16:52+00:00","versionOfRecord":[],"versionCreatedAt":"2025-12-11 11:27:43","video":"","vorDoi":"","vorDoiUrl":"","workflowStages":[]},"version":"v1","identity":"rs-7827944","journalConfig":"researchsquare"},"__N_SSP":true},"page":"/article/[identity]/[[...version]]","query":{"redirect":"/article/rs-7827944","identity":"rs-7827944","version":["v1"]},"buildId":"8U1c8b4HqxoKbykW_rLl7","isFallback":false,"isExperimentalCompile":false,"dynamicIds":[84888],"gssp":true,"scriptLoader":[]}