Microscale metal additive manufacturing by solid-state impact bonding of shaped thin films

Microscale metal additive manufacturing by solid-state impact bonding of shaped thin films | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Article Microscale metal additive manufacturing by solid-state impact bonding of shaped thin films Alain Reiser, Christopher Schuh This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-5160762/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract The deposition of device-grade inorganic materials is one key challenge towards the implementation of additive manufacturing in microfabrication, and to that end, a broad range of physico-chemical principles has been explored for 3D fabrication with micro- and nanoscale resolution. Yet, for metals, we still lack a process that achieves material quality rivaling that of established thin-film deposition methods and at the same time has potential to combine high throughput production with a broad palette of processable materials. Here we introduce the kinetic, solid-state bonding of metal thin films for the additive assembly of high-purity, high-density metals with micrometer-scale precision. Indirect laser ablation accelerates micrometer-thick gold films to hundreds of meters per second without their heating or ablation. Their subsequent impact on the substrate above a critical velocity forms a permanent, metallic bond in the solid state. Stacked layers are of high density (>99%). By defining thin-film layers with established lithographical methods prior to launch, we demonstrate a variable feature size (2-50 μm), arbitrary shape of bonded layers and parallel transfer of up to 36 independent film units in a single shot. We thus establish the solid-state kinetic bonding principle as a viable and potentially versatile route for micro-scale AM of metals. Physical sciences/Materials science/Techniques and instrumentation/Design, synthesis and processing Physical sciences/Engineering/Mechanical engineering Physical sciences/Materials science/Nanoscale materials/Synthesis and processing Physical sciences/Materials science/Structural materials/Metals and alloys 3D printing additive manufacturing microfabrication thin films metals particle impact testing impact bonding laser-induced forward transfer Full Text Additional Declarations There is NO Competing Interest. Supplementary Files ReiserSchuh2024SI.pdf Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-5160762","acceptedTermsAndConditions":true,"allowDirectSubmit":true,"archivedVersions":[],"articleType":"Article","associatedPublications":[],"authors":[{"id":365034316,"identity":"938131a1-7f7d-400d-9bc9-230fdd8c8f52","order_by":0,"name":"Alain Reiser","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAAs0lEQVRIiWNgGAWjYJCCA0AsJ8HAQ6IWYwk2UrSAQOIMorXwzz588OCPinvpM+f3HmD8UUGEFolzaQmHec4U585m40tg5jlDjDVneAwOM7Yl5M5j4zFgZmwjQof8Gf4PB3/+S0iXA2ph/PmPCC0GZ3gYDvA2JCRIA7Uw8DYQocXwDJvBYZ5jCYYz23JADCK0yJ1hfvzxR02CvMThM4YPf9QQoQUFHCBVwygYBaNgFIwCHAAAjvQzaWfe7doAAAAASUVORK5CYII=","orcid":"https://orcid.org/0000-0001-9980-7434","institution":"KTH Royal Institute of Technology","correspondingAuthor":true,"prefix":"","firstName":"Alain","middleName":"","lastName":"Reiser","suffix":""},{"id":365034317,"identity":"e91e976b-1a31-4a45-99d1-0f269b50d9fc","order_by":1,"name":"Christopher Schuh","email":"","orcid":"https://orcid.org/0000-0001-9856-2682","institution":"Northwestern University","correspondingAuthor":false,"prefix":"","firstName":"Christopher","middleName":"","lastName":"Schuh","suffix":""}],"badges":[],"createdAt":"2024-09-26 19:35:11","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-5160762/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-5160762/v1","draftVersion":[],"editorialEvents":[],"editorialNote":"","failedWorkflow":false,"files":[{"id":69380101,"identity":"d2b2de05-3578-4fd7-8c1a-55d04edff3cf","added_by":"auto","created_at":"2024-11-19 18:28:27","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":1038206,"visible":true,"origin":"","legend":"","description":"","filename":"ReiserSchuh2024.pdf","url":"https://assets-eu.researchsquare.com/files/rs-5160762/v1_covered_515e971d-8690-4ec7-94e7-42b11b791562.pdf"},{"id":66621809,"identity":"cf0e33a3-baa0-4355-a7da-1ca8da52c72c","added_by":"auto","created_at":"2024-10-15 02:27:28","extension":"pdf","order_by":2,"title":"","display":"","copyAsset":false,"role":"supplement","size":830503,"visible":true,"origin":"","legend":"","description":"","filename":"ReiserSchuh2024SI.pdf","url":"https://assets-eu.researchsquare.com/files/rs-5160762/v1/34c17cd35f8e2032a2e81f56.pdf"}],"financialInterests":"There is \u003cb\u003eNO\u003c/b\u003e Competing Interest.","formattedTitle":"Microscale metal additive manufacturing by solid-state impact bonding of shaped thin films","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":true,"hideJournal":true,"highlight":"","institution":"","isAcceptedByJournal":false,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":false,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"researchsquare","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":true,"externalIdentity":"","sideBox":"","snPcode":"","submissionUrl":"/submission","title":"Research Square","twitterHandle":"researchsquare","acdcEnabled":true,"dfaEnabled":false,"editorialSystem":"","reportingPortfolio":"","inReviewEnabled":false,"inReviewRevisionsEnabled":true},"keywords":"3D printing, additive manufacturing, microfabrication, thin films, metals, particle impact testing, impact bonding, laser-induced forward transfer","lastPublishedDoi":"10.21203/rs.3.rs-5160762/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-5160762/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"The deposition of device-grade inorganic materials is one key challenge towards the implementation of additive manufacturing in microfabrication, and to that end, a broad range of physico-chemical principles has been explored for 3D fabrication with micro- and nanoscale resolution. 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