Feasibility study for high-aspect ratio copper pin mounting using particle dynamics simulation with stochastic approach

Feasibility study for high-aspect ratio copper pin mounting using particle dynamics simulation with stochastic approach | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Feasibility study for high-aspect ratio copper pin mounting using particle dynamics simulation with stochastic approach Kwang-Hee Lee, Geunsik Ahn, Chul-Hee Lee This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-4266441/v1 This work is licensed under a CC BY 4.0 License Status: Under Revision Version 1 posted 5 You are reading this latest preprint version Abstract Since the demand of advanced packaging for semiconductor industry becomes higher for smaller and thinner applications such as mobile phone, wearable devices, etc., adapting high-aspect ratio of pin in packaging becomes more important. As the aspect ratio of pin becomes bigger, it is challenging to mount pins on the substrate under high speed. Novel mounting method for pin mounting is suggested but its mounting efficiency is possibly affected by mask dimensions. Two criteria are proposed to evaluate the mounting efficiency and calculated to validate the results from the simulation results in stochastic approach. Three design parameters are considered for the analysis and simulations are conducted. Simulations results show similar tendency compared to the calculation of criteria, mounting angle, and ratio. The highest mounting efficiency is observed when the hole diameter of a mask is increased. These results can be used to design a mask with various aspect-ratio of pins for packaging. Advanced packaging Fine pitch Cu pin Pin mounting Full Text Cite Share Download PDF Status: Under Revision Version 1 posted Editorial decision: Major Revisions Needed 01 Jul, 2024 Reviewers agreed at journal 28 Apr, 2024 Reviewers invited by journal 28 Apr, 2024 Editor assigned by journal 18 Apr, 2024 First submitted to journal 16 Apr, 2024 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-4266441","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":296421306,"identity":"c58dd26e-57b1-4b7f-9920-64d8b24481db","order_by":0,"name":"Kwang-Hee Lee","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Kwang-Hee","middleName":"","lastName":"Lee","suffix":""},{"id":296421307,"identity":"dd93ebd6-5e96-4dfd-b771-b81451fcccc3","order_by":1,"name":"Geunsik Ahn","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Geunsik","middleName":"","lastName":"Ahn","suffix":""},{"id":296421308,"identity":"30caac59-3b62-4c34-be46-d765dcb8e96a","order_by":2,"name":"Chul-Hee Lee","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAAyElEQVRIiWNgGAWjYDACCQbGw0BKjo2BByZAWAsDSIsx6VoSG4jWwj+7x+BwQYVNep9078EPDDV2DJKzDxCw5M4Zg8MzzqTltsmcS5ZgOJbMIM2XgF+LgUSOwWHetsO5bUCGBAPbAQY5HgIOg2j59z+dTSLH+AfDP6K1NBxIAGoxk2BsO8AgTUiLxI20gsM8x5INgQ4zs0jsS+aR7CGghX9G8sbHPDV28vIzcoxvfPhmJydxhoAWVJDAwEDIWaNgFIyCUTAKiAEAIQU5Nc++n2oAAAAASUVORK5CYII=","orcid":"","institution":"Inha University","correspondingAuthor":true,"prefix":"","firstName":"Chul-Hee","middleName":"","lastName":"Lee","suffix":""}],"badges":[],"createdAt":"2024-04-14 23:37:23","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-4266441/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-4266441/v1","draftVersion":[],"editorialEvents":[],"editorialNote":"","failedWorkflow":false,"files":[{"id":55799623,"identity":"65f8580b-efa1-4990-a587-855fd958b5ef","added_by":"auto","created_at":"2024-05-03 12:15:27","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":1035173,"visible":true,"origin":"","legend":"","description":"","filename":"IJAMTSubmission231011.pdf","url":"https://assets-eu.researchsquare.com/files/rs-4266441/v1_covered_eb579a84-f94d-4301-85fe-14cc628ef828.pdf"}],"financialInterests":"","formattedTitle":"Feasibility study for high-aspect ratio copper pin mounting using particle dynamics simulation with stochastic approach","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":false,"hideJournal":false,"highlight":"","institution":"","isAcceptedByJournal":false,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":false,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"the-international-journal-of-advanced-manufacturing-technology","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"jamt","sideBox":"Learn more about [The International Journal of Advanced Manufacturing Technology](https://www.springer.com/journal/170)","snPcode":"170","submissionUrl":"https://submission.nature.com/new-submission/170/3","title":"The International Journal of Advanced Manufacturing Technology","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"em","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false},"keywords":"Advanced packaging, Fine pitch, Cu pin, Pin mounting","lastPublishedDoi":"10.21203/rs.3.rs-4266441/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-4266441/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eSince the demand of advanced packaging for semiconductor industry becomes higher for smaller and thinner applications such as mobile phone, wearable devices, etc., adapting high-aspect ratio of pin in packaging becomes more important. 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