Packaging-Aware EMC for 2.5D/3D Semiconductor Devices with Key-Point Radiated Checks

This work presents HiPAC-EMC, a packaging-aware electromagnetic compatibility (EMC) workflow that couples isomorphic co-modeling-device, package/interposer, printed circuit board (PCB), cable, line impedance stabilization network (LISN), and receiver/probes-with closed-loop measurements based on conducted overlays using quasi-peak (QP) detection and magnetic near-field maps. Two quantitative indices, mitigation efficiency and common-mode hot-spot headroom , convert spectra and field maps into actionable design signals. Across two primary boards and packages (A/PKG-1, B/PKG-2), a micro-variant (Board-C), and an additional device class (Module-D/PKG-3 with a different package and load), dominant common-mode peaks appeared near 300, 450, 600, and 800 MHz, and simulation and measurement agreed within ±2-3 dB under a combined uncertainty of 1σ≈3.1 dB. A perimeter guard-plane with via-fence, a 150 µH common-mode choke, and spread-spectrum clocking (SSC) with edge-rate control delivered 18-20 dB reduction near 300 MHz and 15-18 dB near 800 MHz, with combined suppression up to 22-25 dB. Radiated coverage was intentionally limited to key points, including two absolute 3 m checks, two 10 m cross-site single points, and two high-frequency windows at ≈1.2 GHz and ≈1.65 GHz, rather than full-band 3 m/10 m certification curves. Over n = 40 operating and layout points, η correlated with common-mode peaks (r = 0.81-0.85), and a classifier using {η,HCM} achieved AUC≈0.90. A FAIR-aligned repository (tag and SHA available) provides S-parameters, SPICE models, CSV spectra, near-field matrices, and analysis notebooks.