Room-temperature printing of 2D GaN semiconductor via liquid metal gallium surface confined nitridation reaction

Outstanding wide-bandgap semiconductor materials like gallium nitride (GaN) have been extensively utilized in power electronics, radiofrequency power amplifiers, and harsh environment adaptability. Due to its quantum confinement impact in enabling desired deep-ultraviolet emission, excitonic impact, and electronic transport features, two-dimensional (2D) GaN has been one of the most remarkable areas for the future growth of microelectronic devices. Here, for the first time, we report a large area, wide bandgap, and room-temperature 2D GaN synthesis and printing strategy via liquid metal gallium surface-confined nitridation reaction. The developed low-temperature synthesis and printing process is consistent with various electronic device manufacturing methods and thus opens a way for the cost-effective growth of the third-generation semiconductor. In particular, the fully printed field-effect transistors relying on the GaN show p-type switching with an on/off ratio greater than 105, maximum field-effect hole mobility of 53 cm2 V−1 s−1, and a small sub-threshold swing at room temperature. The current study establishes a room temperature way to produce the GaN, which can be further verified, generalized, and realized for various upcoming electronic and photoelectronic applications.