Electronic Upcycling of Corn Straw: Biobased Elastic Conductive Cross-linked Network Eco-friendly Hydrogels with multifunction for Flexible Wearable Sensors | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Article Electronic Upcycling of Corn Straw: Biobased Elastic Conductive Cross-linked Network Eco-friendly Hydrogels with multifunction for Flexible Wearable Sensors Junyao Wang, Huan Liu, Taipeng Wang, Guangze Gao, Yaqun Li, Dingyi Ren, and 5 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-4428632/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract The conductive hydrogels based on biomaterials have garnered much attention. However, the utilization of corn straw, an agricultural waste, as a gel substrate can achieve the recycling of agro-waste and the development of advanced electronic materials, which has a dual benefit strategy seems to be overlooked. In this study, a corn straw pith (CSP) based multifunctional conductive hydrogel (CSP-MCG) was prepared by introducing CSP, which presents oxygen-rich groups, into the three-dimensional crosslinking network system of the hydrogel. The CSP-MCG has mechanical elasticity (maximum tensile rate of 340%) and responsiveness to external environmental factors (mechanical strain, temperature, humidity): Under different tensile strain conditions, the fatigue response is stable and the sensitivity is high (GF=2.8, R2=0.996, Tres=0.075s);In temperature range 20℃-50℃, it exhibits great performance (R2=0.993, TCR=1.34%/℃, Tres=0.5s); Within the humidity range RH29%-79%, the signal changes steadily and the response time is short (Tres=0.2s). In addition, CSP-MCG not only exhibits responsiveness to various external stimuli, but also demonstrates the ability to differentiate between these stimuli based on variation trend in its resistance and capacitance. Due to its exceptional multi-functional sensing capabilities and environmental attribute (recyclability and degradability), CSP-MCG can be as green flexible electronic material in practical applications such as electronic skin, human-computer interaction and flexible wearable sensors. Physical sciences/Materials science/Materials for devices/Sensors and biosensors Physical sciences/Materials science/Nanoscale materials/Electronic properties and materials corn straw pith waste upcycling recyclability multifunctional conductive hydrogel biomaterials Full Text Additional Declarations There is NO Competing Interest. Supplementary Files Supplementaryinformation.pdf Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. 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