Large Organellar Changes Occur during Mild Heat Shock in Yeast

When the temperature is increased, the heat shock response is activated to protect the cellular environment. The transcriptomics and proteomics of this process are intensively studied, while information about how the cell responds structurally to heat stress is mostly lacking. Here, Saccharomyces cerevisiae were subjected to a mild continuous heat shock and intermittently cryo-immobilized for electron microscopy. Through measuring changes in all distinguishable organelle numbers, sizes, and morphologies in over 2400 electron micrographs a major restructuring of the cell’s internal architecture during the progressive heat shock was revealed. The cell grew larger but most organelles within it expanded even more. Organelles responded to heat shock at different times, both in terms of size and number, and adaptations of certain organelles’ morphology were observed. Multivesicular bodies grew to almost 170% in size, indicating a previously unknown involvement in the heat shock response. A previously undescribed electron translucent structure accumulated close to the plasma membrane during the entire time course. This all-encompassing approach provides a detailed chronological progression of organelle adaptation throughout the cellular stress response. Summary statement Exposure to mild heat shock leads to large quantifiable changes in the cellular ultrastructure of yeast, shows involvement of MVBs in the heat shock response and the apparition of novel structures.