A Miniaturized Integrated Wireless Passive Antenna Sensor Based on Meandering Technology for Multi-Directional Strain and Temperature Sensing

A Miniaturized Integrated Wireless Passive Antenna Sensor Based on Meandering Technology for Multi-Directional Strain and Temperature Sensing | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Article A Miniaturized Integrated Wireless Passive Antenna Sensor Based on Meandering Technology for Multi-Directional Strain and Temperature Sensing Helei Dong, Liangjie Guo, Siyu Liang, Xin Tian, He Fu, Tenteng Dong, and 3 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-7712278/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 09 May, 2026 Read the published version in Microsystems & Nanoengineering → Version 1 posted 11 You are reading this latest preprint version Abstract To address the pressing demands for real-time, wireless, and multi-dimensional monitoring of mechanical states in high-speed rotating machinery, large-scale architectural structures, and specialized enclosed systems under complex operating conditions, as well as temperature sensing requirements in new energy applications, this paper proposes a wireless, passive, and miniaturized multi-directional strain/temperature integrated sensor. Featuring a compact structure and weldable/adhesive mounting capabilities, the sensor is particularly suitable for applications with wiring constraints, power supply challenges, and requirements for synchronous multi-directional strain monitoring. To reduce mutual coupling between patch antennas, a novel stepped structure integrates three patch antennas into a single unit. Furthermore, by employing meandering technology with T-shaped slots etched on the patch surface to extend the equivalent current path, sensor miniaturization is achieved. Experimental results demonstrate significant reduction in radiating patch area, with the three patches achieving area reductions of 53.0%, 29.3%, and 42.3% respectively compared to conventional designs of the same resonant frequency and material, while the overall sensor area is reduced by 59.7%. A strain measurement system was set up with a horn antenna as the interrogator to test the sensor under 0–500 με along 0°, 45°, and 135° directions. Additionally, a high-temperature-resistant, miniaturized broadband coplanar waveguide antenna was designed to replace the horn antenna as the interrogator for temperature sensing, thereby forming a temperature measurement system capable of testing the sensor over a range of 50 to 800 °C. The measured results show good agreement with the simulations, indicating that the sensor is capable of either effectively characterizing temperature variations in high-temperature environments or performing simultaneous strain measurements in multiple directions, with a strain sensitivity of up to 32.27 kHz/με and a temperature sensitivity of 341.67 KHz/℃. Under all tested conditions, the fitting error was less than 0.1%, while the standard deviation of repeatability was below 0.1 MHz for strain measurements and below 0.9 MHz for temperature measurements. Physical sciences/Nanoscience and technology/Nanoscale devices/Sensors Physical sciences/Nanoscience and technology/Nanoscale materials/Structural properties Physical sciences/Engineering/Electrical and electronic engineering Full Text Additional Declarations There is no conflict of interest Supplementary Files SupplementaryMaterial.pdf Simulation of the integrated sensor design (without meandering) Cite Share Download PDF Status: Published Journal Publication published 09 May, 2026 Read the published version in Microsystems & Nanoengineering → Version 1 posted Editorial decision: revise 09 Dec, 2025 Review # 3 received at journal 08 Dec, 2025 Review # 1 received at journal 03 Dec, 2025 Review # 2 received at journal 01 Dec, 2025 Reviewer # 3 agreed at journal 21 Nov, 2025 Reviewer # 2 agreed at journal 17 Nov, 2025 Reviewer # 1 agreed at journal 05 Nov, 2025 Reviewers invited by journal 02 Nov, 2025 Submission checks completed at journal 10 Oct, 2025 Editor assigned by journal 25 Sep, 2025 First submitted to journal 25 Sep, 2025 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. 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