Effects of microstructure on reliability of BME-MLCCs

Effects of microstructure on reliability of BME-MLCCs | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Effects of microstructure on reliability of BME-MLCCs Yunfei He, Qijun Cheng, Fengju Yi, Zengwei Zheng, Qihang Yang This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-9197207/v1 This work is licensed under a CC BY 4.0 License Status: Under Review Version 1 posted 9 You are reading this latest preprint version Abstract Five types of base metal multilayer ceramic dielectric capacitors (BME-MLCCs) with distinct microstructure were fabricated by adjusting the grinding intensity. The microstructural characteristics of the ceramics, including micro-morphology, grain size, and pore distribution, were analyzed using a scanning electron microscope (SEM). The impact of the microstructure of the ceramic thin films on the electrical properties and reliability of BME-MLCCs was discussed. The study found that when the grinding was insufficient or excessive, microscopic issues such as non-compactness, unevenness, and pores appeared in the dielectric layer, leading to capacity dispersion, a decline in insulation performance, and reduced reliability. It can thus be seen that grinding intensity serves as the foundation for preparing the dielectric layer, and a high-quality microscopic morphology of the dielectric layer is the key to achieving stable electrical properties and high reliability. grinding intensity microstructure reliability BME-MLCC Full Text Additional Declarations No competing interests reported. Cite Share Download PDF Status: Under Review Version 1 posted Reviewers agreed at journal 16 Apr, 2026 Reviews received at journal 13 Apr, 2026 Reviewers agreed at journal 01 Apr, 2026 Reviews received at journal 31 Mar, 2026 Reviewers agreed at journal 30 Mar, 2026 Reviewers invited by journal 27 Mar, 2026 Editor assigned by journal 25 Mar, 2026 Submission checks completed at journal 24 Mar, 2026 First submitted to journal 23 Mar, 2026 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-9197207","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":614895458,"identity":"d3882e9c-b452-47f4-a801-c1838b28fb85","order_by":0,"name":"Yunfei He","email":"","orcid":"","institution":"Chengdu Hongke Electronic Technology Co., Ltd","correspondingAuthor":false,"prefix":"","firstName":"Yunfei","middleName":"","lastName":"He","suffix":""},{"id":614895459,"identity":"fdcba6ee-71b2-4050-9747-6816f5a3a2f3","order_by":1,"name":"Qijun Cheng","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAAuUlEQVRIiWNgGAWjYNACAwY7fmbmww9I0pIs2c6WZkCSPYwbzvMoSBCllL/97MPHPAV3mI0P8wAtq7GJJqhF4ky6seEMg2d8Zod5DzxgOJaW20BIiwFDGpvEB4PDzGaH+RIMGBsOE6GF/xn7jwSDw4ybm3kMJIjTIpHGxgC0hXEDM7FaJG48Y5acYXA4WeIwMJATiPELf38a42eeP4ft+PsPH37wocaGsBZUkECa8lEwCkbBKBgFuAAA1vc52utQ588AAAAASUVORK5CYII=","orcid":"","institution":"Chengdu Hongke Electronic Technology Co., Ltd","correspondingAuthor":true,"prefix":"","firstName":"Qijun","middleName":"","lastName":"Cheng","suffix":""},{"id":614895460,"identity":"bf578306-0c2f-480c-abdc-dcd0b81111c5","order_by":2,"name":"Fengju Yi","email":"","orcid":"","institution":"Chengdu Hongke Electronic Technology Co., Ltd","correspondingAuthor":false,"prefix":"","firstName":"Fengju","middleName":"","lastName":"Yi","suffix":""},{"id":614895461,"identity":"7115661b-6889-48da-8060-44e6584805d5","order_by":3,"name":"Zengwei Zheng","email":"","orcid":"","institution":"Chengdu Hongke Electronic Technology Co., Ltd","correspondingAuthor":false,"prefix":"","firstName":"Zengwei","middleName":"","lastName":"Zheng","suffix":""},{"id":614895462,"identity":"01cf2e30-fb49-4c8d-abe9-d3e9e7cd0bf2","order_by":4,"name":"Qihang Yang","email":"","orcid":"","institution":"Chengdu Hongke Electronic Technology Co., Ltd","correspondingAuthor":false,"prefix":"","firstName":"Qihang","middleName":"","lastName":"Yang","suffix":""}],"badges":[],"createdAt":"2026-03-23 07:55:03","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-9197207/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-9197207/v1","draftVersion":[],"editorialEvents":[],"editorialNote":"","failedWorkflow":false,"files":[{"id":105800604,"identity":"61a9aad2-745b-4803-82c0-9827d088b69a","added_by":"auto","created_at":"2026-03-31 09:29:13","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":1100651,"visible":true,"origin":"","legend":"","description":"","filename":"Manuscriput.pdf","url":"https://assets-eu.researchsquare.com/files/rs-9197207/v1_covered_43756b22-8b50-4ba2-91f6-2db026501550.pdf"}],"financialInterests":"No competing interests reported.","formattedTitle":"Effects of microstructure on reliability of BME-MLCCs","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":false,"hideJournal":false,"highlight":"","institution":"","isAcceptedByJournal":false,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":false,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"microsystem-technologies","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"mite","sideBox":"Learn more about [Microsystem Technologies](http://link.springer.com/journal/542)","snPcode":"542","submissionUrl":"https://submission.nature.com/new-submission/542/3","title":"Microsystem Technologies","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"stoa","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false},"keywords":"grinding intensity, microstructure, reliability, BME-MLCC","lastPublishedDoi":"10.21203/rs.3.rs-9197207/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-9197207/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eFive types of base metal multilayer ceramic dielectric capacitors (BME-MLCCs) with distinct microstructure were fabricated by adjusting the grinding intensity. 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