Thermally Engineered Multilevel Hybrid Encryption Device with Dynamic Erasure and Ultra-High Data Concealment Capacity

Thermally Engineered Multilevel Hybrid Encryption Device with Dynamic Erasure and Ultra-High Data Concealment Capacity | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Article Thermally Engineered Multilevel Hybrid Encryption Device with Dynamic Erasure and Ultra-High Data Concealment Capacity Tapajyoti Das Gupta, SRIJEETA BISWAS, Renu Sahu, Omkar Nayak Shinkre, and 3 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-6887356/v1 This work is licensed under a CC BY 4.0 License Status: Under Review Version 1 posted You are reading this latest preprint version Abstract The escalating demand for secure data transmission has positioned encryption technologies at the forefront of information protection. Conventional encryption systems, whether purely hardware or software-based, risk major information leaks due to limited encryption levels and also fall short on dynamic erasability. Hardware based methodologies involving photonics-based encryption methods mostly deal with nano and micro-structures, particularly those capable of responsive erasure and regeneration. Thus far however, current techniques for modulating these architectures largely depend on network rearrangement, posing challenges for in situ regeneration. Furthermore, their common fabrication techniques are complex and uncontrolled. To address these fundamental limitations, we showcase a controlled thermal process strategy for fabricating large-area, dynamically tunable, 1D, 2D and 3D ordered microstructures on a wide range of compatible materials including optical glasses, metals and polymers. By controlled tuning of temperature changes in the system, along with the thermal expansion coefficients of thin films and substrates, surface energy, Young’s modulus, and film thickness, we show a precise control on their arrangement, thus enabling the fabrication of robust, uniform, and periodic patterns over large areas on soft and stretchable substrates. Building on this advancement, we demonstrate a hybrid multilevel encryption system. Our hybrid approach combines the strengths of both paradigms (hardware as well as software), while effectively eliminating their respective shortcomings. The resulting device is not only highly scalable and tunable, leading to dynamic erasure but also offers unprecedented security. With decryption probabilities as low as 10⁻⁵³ and 10⁻¹⁵⁵ with just 16 and 36 pixels respectively, our device sets a new benchmark in encryption technology, achieving a level of security never before demonstrated. Physical sciences/Optics and photonics/Optical materials and structures/Metamaterials Physical sciences/Materials science/Soft materials/Self-assembly Physical sciences/Materials science/Materials for optics/Metamaterials Physical sciences/Nanoscience and technology/Nanoscale materials/Metamaterials Hybrid encryption dynamic tunability self-assembly ordered microstructures chalcogenide glass tunable gratings mechanochromic sensors adaptive camouflage Full Text Additional Declarations There is NO Competing Interest. Supplementary Files SupplementaryInformation.pdf Supplementary Information V4WorkingoftheENCDECapplication.mp4 Working of the ENC-DEC application V1Temperaturedependanceofwrinklewavelength.mp4 Temperature dependance of wrinkle wavelength V3WrinkledfilmsforMechanochromicsensor.mp4 Wrinkled films for mechanochromic sensors V2ThermallyTunableCamouflage.mp4 Thermally tunable camouflage Cite Share Download PDF Status: Under Review Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-6887356","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Article","associatedPublications":[],"authors":[{"id":483058267,"identity":"0b293773-e0db-428d-ab81-f5c03037a0fc","order_by":0,"name":"Tapajyoti Das 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