A constitutive model based on internal variable method for the microstructure simulation of four-layer structure formed by the superplastic forming/diffusion bonding process

A constitutive model based on internal variable method for the microstructure simulation of four-layer structure formed by the superplastic forming/diffusion bonding process | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article A constitutive model based on internal variable method for the microstructure simulation of four-layer structure formed by the superplastic forming/diffusion bonding process Dipeng Wu, Yong Wu, Ronglei Fan, Jiayang Qiu, Minghe Chen This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-3144218/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 06 Dec, 2023 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted 5 You are reading this latest preprint version Abstract This study set out to realize the prediction of microstructure evolution and mechanical properties of the titanium alloy four-layer structure formed by the superplastic forming/diffusion bonding (SPF/DB) process. The flow behavior and the microstructure evolution of TC31 alloy were studied by the high-temperature experiments. A physically-based constitutive model was established and applied in the superplastic forming process of the four-layer structure. The TC31 titanium alloy four-layer structure was fabricated to verify the accuracy of the constitutive model. The results showed that the main reason for the increase in material stress and the decrease in elongation was the growth of grains. The TC31 four-layer structure was soundly fabricated by SPF/DB process, and the maximum damage value of the structure was located at the sidewall area with a value of 0.16. The compression strength of the structure was 19.0MPa, and the compression failure mode of the four-layer structure was the cracking of the bonding area. The experimental results were similar to the simulation results, which demonstrated that the finite element simulation with the internal variable model could accurately predict the shape, the thickness distribution and the damage distribution of the four-layer structure during the SPF process. Titanium alloy Four-layer structure SPF/DB Constitutive modeling Full Text Cite Share Download PDF Status: Published Journal Publication published 06 Dec, 2023 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted Editorial decision: Minor Revisions Needed 10 Nov, 2023 Reviewers agreed at journal 14 Jul, 2023 Reviewers invited by journal 10 Jul, 2023 Editor assigned by journal 09 Jul, 2023 First submitted to journal 07 Jul, 2023 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-3144218","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":217124291,"identity":"d38e2dd3-c2ef-44b7-80c6-ce6774f58717","order_by":0,"name":"Dipeng Wu","email":"","orcid":"","institution":"","correspondingAuthor":false,"submittingAuthor":false,"prefix":"","firstName":"Dipeng","middleName":"","lastName":"Wu","suffix":""},{"id":217124292,"identity":"8db278a7-d44e-4674-a0d3-92bd1270cdd5","order_by":1,"name":"Yong 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