Using Deep Eutectic Solvent-Assisted Plating Baths to Electrodeposit Composite Coatings: A Review

This review provides a systematic analysis of the literature data on the electrodeposition of composite coatings using plating baths based on a new generation of room-temperature ionic liquids, known as deep eutectic solvents (DESs). Such systems offer several advantages over traditionally used aqueous electrolytes and organic solvent-based electrolytes. The colloidal-chemical properties of suspension and colloidal electrolytes for composite deposition are thoroughly examined. New theories describing the kinetics of co-deposition of composite layers are characterized. The kinetics and mechanism of electrochemical deposition processes of composite coatings with metallic matrices are discussed. Case studies regarding the electrodeposition of composite coatings based on electrodeposited copper, silver, zinc, tin, nickel, cobalt, and chromium from DES-assisted electroplating baths are described and systematized. The main prospective directions for further research in the discussed scientific area are highlighted.