Study on the Effect of Polishing Pad Layer Structure on Dishing Control in Chemical Mechanical Planarization of Through-Silicon Via Copper Patterned Wafer

Study on the Effect of Polishing Pad Layer Structure on Dishing Control in Chemical Mechanical Planarization of Through-Silicon Via Copper Patterned Wafer | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Study on the Effect of Polishing Pad Layer Structure on Dishing Control in Chemical Mechanical Planarization of Through-Silicon Via Copper Patterned Wafer Quoc-Phong Pham, Le Nam Quoc Huy This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-8492857/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 02 May, 2026 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted 5 You are reading this latest preprint version Abstract In advanced semiconductor manufacturing, copper interconnects fabricated via the dual damascene process rely heavily on chemical mechanical planarization (CMP) to achieve global planarity and defect-free surfaces. However, achieving optimal material removal uniformity, minimal dishing in recessed features, and low surface roughness remains challenging for through-silicon via copper structure on patterned wafers. Addressing these issues, this study developed a novel in-situ downforce simulation apparatus combined with the quadrat method for asperity spatial analysis to elucidate the role of polishing pad layer architecture in CMP performance. Multi-scale nano-indentation and real-time contact imaging were employed to compare the monolithic IC1000 polishing pad with the bilayer ICSU polishing pad. Results revealed that the ICSU polishing pad, owing to its compliant Suba™ IV sub-layer, exhibits greater asperity deformability, higher real contact area ratio, and more uniform asperity distribution under various downforce. Consequently, the ICSU polishing pad delivered superior CMP surface roughness and within-wafer uniformity, whereas the stiffer IC1000 polishing pad provided better dishing control in patterned features. These findings highlight fundamental trade-offs in polishing pad design and offer practical guidance for polishing pad selection in high-density copper interconnect CMP process, with potential to enhance yield and reliability in next-generation devices. Polishing pad architecture Dishing control Asperity contact behavior Chemical mechanical planarization (CMP) Patterned wafer Full Text Cite Share Download PDF Status: Published Journal Publication published 02 May, 2026 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted Editorial decision: Major Revisions Needed 18 Feb, 2026 Reviewers agreed at journal 07 Jan, 2026 Reviewers invited by journal 07 Jan, 2026 Editor assigned by journal 06 Jan, 2026 First submitted to journal 04 Jan, 2026 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-8492857","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":571066284,"identity":"d95e23d2-f893-4898-b132-702db7a52d75","order_by":0,"name":"Quoc-Phong Pham","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAA60lEQVRIiWNgGAWjYDACCSBmbIByPgAxGzvRWtiA9AwQzUyKFmYekAghLebSzU83F+6wyZOP7zGTtvm1TZ6PmYHxw8cc3Fos5xwzuz3zTFqx4TEeM+ncvtuGbcwMzJIzt+HWYnAjwew2b9vhxI1tbGnSuT23GYFa2Jh58WpJ/4bQYtlz254ILTkQW+azMR+TZvhxO5GgFssZOWW3Z7alJW5gSz5s2dtwO7mNmbEZr1/MJdK33S5ss0mc33yw8caPP7dt57c3H/zwEZ/DGKARYXAASDC2gZjwxEBAizxY3R+8ikfBKBgFo2CEAgDoj1J8qCedigAAAABJRU5ErkJggg==","orcid":"https://orcid.org/0000-0002-5579-8799","institution":"Tra Vinh University","correspondingAuthor":true,"prefix":"","firstName":"Quoc-Phong","middleName":"","lastName":"Pham","suffix":""},{"id":571066285,"identity":"ca6f0426-0317-4c79-9e36-ead8d73147ca","order_by":1,"name":"Le Nam Quoc Huy","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Le","middleName":"Nam Quoc","lastName":"Huy","suffix":""}],"badges":[],"createdAt":"2026-01-01 03:02:37","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-8492857/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-8492857/v1","draftVersion":[],"editorialEvents":[{"content":"https://doi.org/10.1007/s00170-026-18235-x","type":"published","date":"2026-05-02T15:58:06+00:00"}],"editorialNote":"","failedWorkflow":false,"files":[{"id":100366703,"identity":"33de0d13-50eb-4e13-a18e-feb72128c471","added_by":"auto","created_at":"2026-01-16 07:56:29","extension":"jpg","order_by":0,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":424823,"visible":true,"origin":"","legend":"","description":"","filename":"Fig1.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/965997bb01898eb12d384662.jpg"},{"id":100107200,"identity":"3b64c666-7622-4fef-b1b5-a9977c21a1c9","added_by":"auto","created_at":"2026-01-13 05:35:14","extension":"jpg","order_by":1,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":108521,"visible":true,"origin":"","legend":"","description":"","filename":"Fig10.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/f873c792d81763dc65a8c928.jpg"},{"id":100107198,"identity":"47fbedb4-9c68-4503-97bf-35d092994109","added_by":"auto","created_at":"2026-01-13 05:35:14","extension":"bib","order_by":2,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":10890,"visible":true,"origin":"","legend":"","description":"","filename":"snbibliography.bib","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/99303e78eb2bb70f999242ef.bib"},{"id":100107202,"identity":"ec695ccf-fab0-423d-b306-1251f73f680e","added_by":"auto","created_at":"2026-01-13 05:35:14","extension":"cls","order_by":4,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":55857,"visible":true,"origin":"","legend":"","description":"","filename":"snjnl.cls","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/df6613c812e907ff7abd86ec.cls"},{"id":100107205,"identity":"9efdfe9a-fbc2-4393-b334-ab948a96c31c","added_by":"auto","created_at":"2026-01-13 05:35:14","extension":"jpg","order_by":5,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":209042,"visible":true,"origin":"","legend":"","description":"","filename":"Fig11.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/9269011f4b4561e7ce7476bc.jpg"},{"id":100366750,"identity":"698992ff-be4b-436b-95e8-a16390c0f3b7","added_by":"auto","created_at":"2026-01-16 07:56:31","extension":"jpg","order_by":6,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":118483,"visible":true,"origin":"","legend":"","description":"","filename":"Fig12.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/d430f7ee1e077ae64559d9dd.jpg"},{"id":100107204,"identity":"ea3ce26e-c4fe-4f0f-af56-c55693292262","added_by":"auto","created_at":"2026-01-13 05:35:14","extension":"jpg","order_by":7,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":132563,"visible":true,"origin":"","legend":"","description":"","filename":"Fig13.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/0299fadd61d391ded5d00f83.jpg"},{"id":100366172,"identity":"acd3b7f2-a6c0-40b0-b3cc-0ec52212af9b","added_by":"auto","created_at":"2026-01-16 07:56:03","extension":"jpg","order_by":8,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":125172,"visible":true,"origin":"","legend":"","description":"","filename":"Fig14.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/1df9e01ab5c98e20b28cb863.jpg"},{"id":100365448,"identity":"e451f648-caaa-4270-b371-6ee95ce52e8a","added_by":"auto","created_at":"2026-01-16 07:55:13","extension":"jpg","order_by":9,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":107037,"visible":true,"origin":"","legend":"","description":"","filename":"Fig2.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/52cd9418efc27999f10de953.jpg"},{"id":100365825,"identity":"cdeb6257-cd5a-412b-bce4-e53215d0606f","added_by":"auto","created_at":"2026-01-16 07:55:40","extension":"jpg","order_by":10,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":176899,"visible":true,"origin":"","legend":"","description":"","filename":"Fig3.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/0155430c5868901ef13dd524.jpg"},{"id":100107206,"identity":"e06547da-c33f-426c-9c6c-64fa90de39f7","added_by":"auto","created_at":"2026-01-13 05:35:14","extension":"jpg","order_by":11,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":160705,"visible":true,"origin":"","legend":"","description":"","filename":"Fig4.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/9afde29b6d0c587479c3b73f.jpg"},{"id":100107234,"identity":"38f33766-6f82-4e9c-8eb4-4df2e733926f","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"jpg","order_by":12,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":84953,"visible":true,"origin":"","legend":"","description":"","filename":"Fig5.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/c5e2173ab202d48e497b1256.jpg"},{"id":100107210,"identity":"ddb1905c-959e-41b5-8196-9deb6725a21d","added_by":"auto","created_at":"2026-01-13 05:35:14","extension":"jpg","order_by":13,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":108379,"visible":true,"origin":"","legend":"","description":"","filename":"Fig6.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/6a9f1622c2eec7543e976a1a.jpg"},{"id":100364785,"identity":"a22949af-af14-48e3-901f-99dc90a362a3","added_by":"auto","created_at":"2026-01-16 07:54:18","extension":"jpg","order_by":14,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":104701,"visible":true,"origin":"","legend":"","description":"","filename":"Fig7.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/2ff7828954cdff167c2d00b5.jpg"},{"id":100365209,"identity":"495a4e9f-1b9d-4305-9e76-12a82b5d9b80","added_by":"auto","created_at":"2026-01-16 07:54:50","extension":"jpg","order_by":15,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":150773,"visible":true,"origin":"","legend":"","description":"","filename":"Fig8.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/1f5a518e3c354a683462b729.jpg"},{"id":100107212,"identity":"acff0c51-61b9-46e0-9103-21b77f18bf5d","added_by":"auto","created_at":"2026-01-13 05:35:14","extension":"jpg","order_by":16,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":160522,"visible":true,"origin":"","legend":"","description":"","filename":"Fig9.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/cd51676c9fdaf6e9b85e471a.jpg"},{"id":100107220,"identity":"8504f14d-be03-4fdc-a3d5-9abf2a694e1d","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"jpg","order_by":17,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":161652,"visible":true,"origin":"","legend":"","description":"","filename":"FigTable1.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/11404ec2f64fe67fc2932d9c.jpg"},{"id":100366269,"identity":"19cbbd3e-2f4d-4dd3-8c2c-209e45a9096a","added_by":"auto","created_at":"2026-01-16 07:56:10","extension":"jpg","order_by":18,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":81717,"visible":true,"origin":"","legend":"","description":"","filename":"FigTable2.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/b1c6189126c312539d880d95.jpg"},{"id":100364814,"identity":"87757020-72a4-4345-a0d8-f6d17023a18a","added_by":"auto","created_at":"2026-01-16 07:54:20","extension":"xml","order_by":19,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":9816,"visible":true,"origin":"","legend":"","description":"","filename":"jamtJAMTD2507580.xml","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/f60e923894814150834d807c.xml"},{"id":100365679,"identity":"66d65aeb-6c01-4f52-a5ba-70c2aecde8a0","added_by":"auto","created_at":"2026-01-16 07:55:30","extension":"xml","order_by":20,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":1498,"visible":true,"origin":"","legend":"","description":"","filename":"JAMTD2507580165762.go.xml","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/d96a8755ae867d0284036eb4.xml"},{"id":100107216,"identity":"ceee876e-4a29-4b12-8625-f6b0f7ab4d99","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"xml","order_by":21,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":966,"visible":true,"origin":"","legend":"","description":"","filename":"JAMTD2507580Import.xml","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/518d505aba903a19bb98f6c4.xml"},{"id":100365242,"identity":"a90a88d2-d57d-4056-b656-4b8d7a40519f","added_by":"auto","created_at":"2026-01-16 07:54:54","extension":"xml","order_by":22,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":83130,"visible":true,"origin":"","legend":"","description":"","filename":"JAMTD25075800enriched.xml","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/5238e2abe3cedbaf7f068956.xml"},{"id":100366418,"identity":"8ac90610-6798-4763-ad8a-21c2a712eb40","added_by":"auto","created_at":"2026-01-16 07:56:18","extension":"jpg","order_by":23,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":424823,"visible":true,"origin":"","legend":"","description":"","filename":"Fig1.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/05cedec840c94ab1aef6de35.jpg"},{"id":100365815,"identity":"2ed517be-8eab-4074-b4f6-117d4dfdb3df","added_by":"auto","created_at":"2026-01-16 07:55:39","extension":"jpg","order_by":24,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":108521,"visible":true,"origin":"","legend":"","description":"","filename":"Fig10.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/1c8c232c68109d21af14ddf6.jpg"},{"id":100367114,"identity":"4df1877b-68a5-43a5-9b40-6b0ddf7a644b","added_by":"auto","created_at":"2026-01-16 07:56:46","extension":"jpg","order_by":25,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":209042,"visible":true,"origin":"","legend":"","description":"","filename":"Fig11.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/790839b97348d0006b1362c7.jpg"},{"id":100367090,"identity":"7856eafa-817a-4b47-8ccf-cc4c33a6abf8","added_by":"auto","created_at":"2026-01-16 07:56:46","extension":"jpg","order_by":26,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":118483,"visible":true,"origin":"","legend":"","description":"","filename":"Fig12.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/46d10559e6f4f9e893949eb1.jpg"},{"id":100364744,"identity":"2ed982c8-d8a5-44c9-8b1a-116fe66677ac","added_by":"auto","created_at":"2026-01-16 07:54:17","extension":"jpg","order_by":27,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":132563,"visible":true,"origin":"","legend":"","description":"","filename":"Fig13.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/a189cf307a3d93c0644dff95.jpg"},{"id":100366402,"identity":"e9a50d6f-77f8-447e-b42e-35aa644813ca","added_by":"auto","created_at":"2026-01-16 07:56:17","extension":"jpg","order_by":28,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":125172,"visible":true,"origin":"","legend":"","description":"","filename":"Fig14.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/3b10a44a759035acdb327fb2.jpg"},{"id":100365702,"identity":"f1e282b6-0c84-4469-b671-b15dbab78daa","added_by":"auto","created_at":"2026-01-16 07:55:32","extension":"jpg","order_by":29,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":107037,"visible":true,"origin":"","legend":"","description":"","filename":"Fig2.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/cf2a265557f8628faded4b10.jpg"},{"id":100107232,"identity":"04a1a502-b482-4714-bf10-c77304954e7b","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"jpg","order_by":30,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":176899,"visible":true,"origin":"","legend":"","description":"","filename":"Fig3.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/791ae1e6c966a3a1744b9958.jpg"},{"id":100107228,"identity":"3a9763b1-cc0f-4327-b831-47cae9d98d7a","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"jpg","order_by":31,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":160705,"visible":true,"origin":"","legend":"","description":"","filename":"Fig4.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/010f98de576e4dabf53e641d.jpg"},{"id":100366249,"identity":"b0c10f0e-20b9-491e-a047-69d4d968a44e","added_by":"auto","created_at":"2026-01-16 07:56:09","extension":"jpg","order_by":32,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":84953,"visible":true,"origin":"","legend":"","description":"","filename":"Fig5.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/1085f4818c5516b0fef36f12.jpg"},{"id":100107229,"identity":"096312cd-3b0b-4451-82b2-1d5fc1f853fe","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"jpg","order_by":33,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":108379,"visible":true,"origin":"","legend":"","description":"","filename":"Fig6.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/6e85dfbcaeaa304c129ca220.jpg"},{"id":100107226,"identity":"7a7e583a-5aff-4ded-9074-9d9cc649ea6e","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"jpg","order_by":34,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":104701,"visible":true,"origin":"","legend":"","description":"","filename":"Fig7.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/f76c5ffb1ade6ddce2a67faa.jpg"},{"id":100107225,"identity":"4e449d95-1b77-4d99-ab21-e94833e9a694","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"jpg","order_by":35,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":150773,"visible":true,"origin":"","legend":"","description":"","filename":"Fig8.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/c39545f74fa02258050bb344.jpg"},{"id":100365125,"identity":"ac9aced2-90ca-46cf-8165-b8e716760f46","added_by":"auto","created_at":"2026-01-16 07:54:41","extension":"jpg","order_by":36,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":160522,"visible":true,"origin":"","legend":"","description":"","filename":"Fig9.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/ecc3d9ea53a54470bbf110c1.jpg"},{"id":100364868,"identity":"51505cab-d807-45b9-bfbe-b24edfadbaa6","added_by":"auto","created_at":"2026-01-16 07:54:25","extension":"jpg","order_by":37,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":161652,"visible":true,"origin":"","legend":"","description":"","filename":"FigTable1.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/e6be7f7726af05cbb11ca470.jpg"},{"id":100365085,"identity":"23a25273-fcd4-43c0-b142-c079a96fffb6","added_by":"auto","created_at":"2026-01-16 07:54:39","extension":"jpg","order_by":38,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":81717,"visible":true,"origin":"","legend":"","description":"","filename":"FigTable2.jpg","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/fee4f513ddc9b511453c3250.jpg"},{"id":100107230,"identity":"01c5b767-b207-4a77-a3ec-5dfea391be11","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"cls","order_by":39,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":55857,"visible":true,"origin":"","legend":"","description":"","filename":"snjnl.cls","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/db99324a90e4c9d3c68f16ed.cls"},{"id":100107237,"identity":"6aaed33e-e84c-4fbb-8ba0-3013c9ebf868","added_by":"auto","created_at":"2026-01-13 05:35:15","extension":"png","order_by":54,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":1140749,"visible":true,"origin":"","legend":"","description":"","filename":"OnlineFigTable1.png","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/f04cc02e02ca024a7bd5d935.png"},{"id":100366482,"identity":"612d9922-1a93-4cfd-825b-fb57f4672b56","added_by":"auto","created_at":"2026-01-16 07:56:19","extension":"png","order_by":55,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":296296,"visible":true,"origin":"","legend":"","description":"","filename":"OnlineFigTable2.png","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/43e7d82a3e8f3e52b8c51e58.png"},{"id":100365716,"identity":"0f82d3bc-38b8-4a03-bddf-d7e18ae339f2","added_by":"auto","created_at":"2026-01-16 07:55:33","extension":"xml","order_by":56,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":85152,"visible":true,"origin":"","legend":"","description":"","filename":"JAMTD25075800structuring.xml","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/ca99b7fd756135d54f4f365d.xml"},{"id":100365191,"identity":"bec62c1e-8cb1-4280-864c-7ceb0af9a9ee","added_by":"auto","created_at":"2026-01-16 07:54:47","extension":"html","order_by":57,"title":"","display":"","copyAsset":false,"role":"acdc-reference","size":91646,"visible":true,"origin":"","legend":"","description":"","filename":"earlyproof.html","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1/0a08af41004a28d9e1257972.html"},{"id":108495138,"identity":"de9ee724-9c5e-4a80-91f3-b8f2cb2320be","added_by":"auto","created_at":"2026-05-05 10:09:05","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":2710397,"visible":true,"origin":"","legend":"","description":"","filename":"JAMTD2507580reviewer.pdf","url":"https://assets-eu.researchsquare.com/files/rs-8492857/v1_covered_5aab3669-4f51-4db4-92aa-6c6a7dea3b0d.pdf"}],"financialInterests":"","formattedTitle":"Study on the Effect of Polishing Pad Layer Structure on Dishing Control in Chemical Mechanical Planarization of Through-Silicon Via Copper Patterned Wafer","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":false,"hideJournal":false,"highlight":"","institution":"","isAcceptedByJournal":true,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":true,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"the-international-journal-of-advanced-manufacturing-technology","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"jamt","sideBox":"Learn more about [The International Journal of Advanced Manufacturing Technology](https://www.springer.com/journal/170)","snPcode":"170","submissionUrl":"https://submission.nature.com/new-submission/170/3","title":"The International Journal of Advanced Manufacturing Technology","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"em","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false},"keywords":"Polishing pad architecture, Dishing control, Asperity contact behavior, Chemical mechanical planarization (CMP), Patterned wafer","lastPublishedDoi":"10.21203/rs.3.rs-8492857/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-8492857/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eIn advanced semiconductor manufacturing, copper interconnects fabricated via the dual damascene process rely heavily on chemical mechanical planarization (CMP) to achieve global planarity and defect-free surfaces. However, achieving optimal material removal uniformity, minimal dishing in recessed features, and low surface roughness remains challenging for through-silicon via copper structure on patterned wafers. Addressing these issues, this study developed a novel in-situ downforce simulation apparatus combined with the quadrat method for asperity spatial analysis to elucidate the role of polishing pad layer architecture in CMP performance. Multi-scale nano-indentation and real-time contact imaging were employed to compare the monolithic IC1000 polishing pad with the bilayer ICSU polishing pad. Results revealed that the ICSU polishing pad, owing to its compliant Suba\u0026trade; IV sub-layer, exhibits greater asperity deformability, higher real contact area ratio, and more uniform asperity distribution under various downforce. Consequently, the ICSU polishing pad delivered superior CMP surface roughness and within-wafer uniformity, whereas the stiffer IC1000 polishing pad provided better dishing control in patterned features. These findings highlight fundamental trade-offs in polishing pad design and offer practical guidance for polishing pad selection in high-density copper interconnect CMP process, with potential to enhance yield and reliability in next-generation devices.\u003c/p\u003e","manuscriptTitle":"Study on the Effect of Polishing Pad Layer Structure on Dishing Control in Chemical Mechanical Planarization of Through-Silicon Via Copper Patterned Wafer","msid":"","msnumber":"","nonDraftVersions":[{"code":1,"date":"2026-01-13 05:35:09","doi":"10.21203/rs.3.rs-8492857/v1","editorialEvents":[{"type":"communityComments","content":0},{"type":"decision","content":"Major Revisions Needed","date":"2026-02-18T15:59:35+00:00","index":"","fulltext":""},{"type":"reviewerAgreed","content":"","date":"2026-01-07T22:36:32+00:00","index":0,"fulltext":""},{"type":"reviewersInvited","content":"","date":"2026-01-07T19:57:01+00:00","index":"","fulltext":""},{"type":"editorAssigned","content":"","date":"2026-01-06T09:50:00+00:00","index":"","fulltext":""},{"type":"submitted","content":"The International Journal of Advanced Manufacturing Technology","date":"2026-01-04T21:34:09+00:00","index":"","fulltext":""}],"status":"published","journal":{"display":true,"email":"[email protected]","identity":"the-international-journal-of-advanced-manufacturing-technology","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":false,"externalIdentity":"jamt","sideBox":"Learn more about [The International Journal of Advanced Manufacturing Technology](https://www.springer.com/journal/170)","snPcode":"170","submissionUrl":"https://submission.nature.com/new-submission/170/3","title":"The International Journal of Advanced Manufacturing Technology","twitterHandle":"","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"em","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":false}}],"origin":"","ownerIdentity":"cb5cc7b7-27f9-44de-8226-ee90a8e04c80","owner":[],"postedDate":"January 13th, 2026","published":true,"recentEditorialEvents":[],"rejectedJournal":[],"revision":"","amendment":"","status":"published-in-journal","subjectAreas":[],"tags":[],"updatedAt":"2026-05-05T10:00:42+00:00","versionOfRecord":{"articleIdentity":"rs-8492857","link":"https://doi.org/10.1007/s00170-026-18235-x","journal":{"identity":"the-international-journal-of-advanced-manufacturing-technology","isVorOnly":false,"title":"The International Journal of Advanced Manufacturing Technology"},"publishedOn":"2026-05-02 15:58:06","publishedOnDateReadable":"May 2nd, 2026"},"versionCreatedAt":"2026-01-13 05:35:09","video":"","vorDoi":"10.1007/s00170-026-18235-x","vorDoiUrl":"https://doi.org/10.1007/s00170-026-18235-x","workflowStages":[]},"version":"v1","identity":"rs-8492857","journalConfig":"researchsquare"},"__N_SSP":true},"page":"/article/[identity]/[[...version]]","query":{"redirect":"/article/rs-8492857","identity":"rs-8492857","version":["v1"]},"buildId":"XKTyCvWXoU3ODBz1xrDgd","isFallback":false,"isExperimentalCompile":false,"dynamicIds":[84888],"gssp":true,"scriptLoader":[]}