Multi-Physics Field Coupling Simulation Analysis And Process Parameter Optimization of ECM Hole-Making Process For Superalloys

Multi-Physics Field Coupling Simulation Analysis And Process Parameter Optimization of ECM Hole-Making Process For Superalloys | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Multi-Physics Field Coupling Simulation Analysis And Process Parameter Optimization of ECM Hole-Making Process For Superalloys Zhiguo Wei, Yizhou Wu, Zhanshuang Wang, Jinjin Liu, Weiwei Liu, and 2 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-6734027/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 20 Dec, 2025 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted 5 You are reading this latest preprint version Abstract Electrochemical processing is crucial for manufacturing cooling holes in nickel-based superalloy films. However, due to the complex interactions among process parameters, optimizing process parameters such as voltage, feed rate, and electrolyte conductivity remains challenging. In this paper, a multi-physics field model coupling the electric field and the flow field is established. The electric field distribution and workpiece deformation during the electrochemical machining process are analyzed, and the gas-liquid two-phase flow model is adopted to simulate the electric field, flow field and current density. Then, by using the central composite design method, the regression equations of the average aperture, average taper and process parameters, as well as the interaction laws of single and multiple factors, were derived. When the diameters are 0.5mm, 0.6mm and 0.7mm, the predicted corresponding optimal parameter combinations are voltages of 30V, 42.2V and 53.8V respectively, the electrical conductivity was 8.7 S/m, 8.7 S/m, 11.4 S/m and the feed rates were 0.46 mm/min, 0.46 mm/min, 0.49 mm/min. Finally, the experiments verified that the maximum errors of diameter and taper were 7.6% and 6.43% respectively. The experimental results proved the accuracy of the model. This work has greatly improved the accuracy of electrochemical processing of cooling holes. Electrochemical Machining Cooling Holes Gas–Liquid Two-Phase Turbulence Model Multi-physics Modeling Central Composite Design Method Full Text Cite Share Download PDF Status: Published Journal Publication published 20 Dec, 2025 Read the published version in The International Journal of Advanced Manufacturing Technology → Version 1 posted Editorial decision: Major Revisions Needed 05 Aug, 2025 Reviewers agreed at journal 25 Jun, 2025 Reviewers invited by journal 25 Jun, 2025 Editor assigned by journal 02 Jun, 2025 First submitted to journal 29 May, 2025 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-6734027","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":476176328,"identity":"e5ad3586-bca6-4b01-b444-01805bbdeefc","order_by":0,"name":"Zhiguo Wei","email":"","orcid":"","institution":"","correspondingAuthor":false,"prefix":"","firstName":"Zhiguo","middleName":"","lastName":"Wei","suffix":""},{"id":476176329,"identity":"2cbe8562-3df4-42f6-b26f-86398616f731","order_by":1,"name":"Yizhou 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