The effect of the vanillin-derived diene compound on the thermal, dielectric and mechanical properties of epoxy resins

In this work, a fluorine-containing diene compound (TFBAM) derived from vanillin was synthesized for modifying epoxy resin (E51). The chemical structure of TFBAM was confirmed by Fourier transform infrared (FTIR) and Nuclear magnetic resonance ( 1 HNMR) spectroscopies. The modified resins (E-TFBAM) were successfully prepared through the introduction of TFBAM into E51, and the consequences of TFBAM dosages on the curing behavior, thermal, mechanical and dielectric properties of E-TFBAM resins were dissected in details. The results revealed that an appropriate concentration of TFBAM could be conductive to improving the thermal stability and dielectric properties of E-TFBAM thermosets without damaging the mechanical properties. The dielectric permittivity and loss of 2.82-2.71 and 0.024-0.015 were obtained when the addition of TFBAM was 30 wt%, with 10–10.2% and 36.8–44.4% of reduction. Additionally, the impact strengths and elongation at break of E-30 TFBAM resin increase to 18.0 kJ/m 2 and 4.7%, respectively. Overall, this research can be seen as essential for expanding the application of the epoxy resins in high-end fields.