Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation

2021 · doi:10.21203/rs.3.rs-982900/v1
preprint OA: closed CC-BY-4.0
📄 Open PDF Full text JSON View at publisher
⚙ AI-generated summary by claude@2026-07+body, 2026-07-05 ⓘ

This study used CFD simulation with different viscometer spindle types (Parallel-plate and Cone-plate) to measure lead-free solder paste deposition volume, finding the PP 0.5 mm gap yielded the lowest discrepancy.

One-sentence paraphrase of the abstract; not a substitute for reading it. No clinical advice. How this works

⚙ AI-generated deep summary by claude@2026-07, 2026-07-05 · read from full text ⓘ

This preprint studied how different viscometer spindle types and settings affect lead-free solder paste deposition during stencil printing, using CFD simulation to estimate solder paste volume filled under varying squeegee speeds and aperture sizes. Experiments and simulations used SAC305 type 3 solder paste, with parallel-plate and cone-plate spindles (PP and CP) and a VOF CFD approach with a Cross viscosity model; key comparisons were made between experimental and simulated deposited volumes. The paper reports that at different squeegee speeds, a PP 0.5 mm gap produced the lowest average discrepancy, and at different aperture sizes trends were similar across tests, with CP1° matching average discrepancy most closely while PP 0.5 mm still performed best, especially at small apertures. A major limitation stated by the preprint context is that it is not peer reviewed. The paper does not explicitly discuss endometriosis or adenomyosis; it was included in the corpus via a keyword match in the upstream search index.

Read from the paper's body, not the abstract. Not a substitute for reading the paper. No clinical advice. How this works

Abstract

Abstract This study discusses the use of different spindle type for the testing of lead-free solder paste by using Computational Fluid Dynamics (CFD) simulation. The study focuses on measuring the volume of solder paste deposition on the solder pad. Parallel-plate (PP) and Cone-plate (CP) spindle were used with five different tests consist of different spindle type and setting. The Volume of Fluid (VOF) method was used for the simulation while Cross model was applied as viscosity model for the solder paste. SAC305 type 3 lead-free solder paste was used in this study as it is mostly popular used by the industries nowadays. The solder paste filled the volume under different squeegee speeds and aperture size was compared between experiments and simulations. For different squeegee speed, PP 0.5 mm gap obtained the lowest average discrepancy value between simulation and experimental results. At different aperture size, all test show similar trend line and about the same value of average discrepancy with CP1° while PP 0.5 mm gap showed the lowest average discrepancy. At small aperture volume, all tests performed shows similar value of filled volume except PP 0.5 mm which exhibit the lowest percentage difference when compared with the experimental values at a bigger aperture volume.
Full text 27,772 characters · extracted from preprint-html · click to expand
Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation Mohammad Hafifi Hafiz Ishak, Mohd Syakirin Rusdi, Mohd Zulkifly Abdullah, and 4 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-982900/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract This study discusses the use of different spindle type for the testing of lead-free solder paste by using Computational Fluid Dynamics (CFD) simulation. The study focuses on measuring the volume of solder paste deposition on the solder pad. Parallel-plate (PP) and Cone-plate (CP) spindle were used with five different tests consist of different spindle type and setting. The Volume of Fluid (VOF) method was used for the simulation while Cross model was applied as viscosity model for the solder paste. SAC305 type 3 lead-free solder paste was used in this study as it is mostly popular used by the industries nowadays. The solder paste filled the volume under different squeegee speeds and aperture size was compared between experiments and simulations. For different squeegee speed, PP 0.5 mm gap obtained the lowest average discrepancy value between simulation and experimental results. At different aperture size, all test show similar trend line and about the same value of average discrepancy with CP1° while PP 0.5 mm gap showed the lowest average discrepancy. At small aperture volume, all tests performed shows similar value of filled volume except PP 0.5 mm which exhibit the lowest percentage difference when compared with the experimental values at a bigger aperture volume. Biotechnology and Bioengineering SAC305 lead-free solder paste Stencil Printing Viscometer SMT Simulation Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Full Text Tables Table 1: Spindle size and gap height Spindle Diameter (mm) Gap Height (mm) Cone Plate 1.014° 24.980 0.051 Cone Plate 2.008° 24.981 0.104 Parallel Plate Gap A 24.985 0.250 Parallel Plate Gap B 24.985 0.500 Parallel Plate Gap C 24.985 0.750 Table 2: Time Step study Case 1 2 3 4 5 Time step 0.01 0.005 0.001 0.0005 0.0001 Experiment Solder Volume (mᶾ) 0.7008324 0.7077731 0.713686 0.7115767 0.6425067 0.770773118 Error (%) 9.1 8.2 7.4 7.7 16.6 - Table 3: Grid Independence Study Case 1 2 3 4 5 No. Of Elements 1952 2632 3712 5192 7072 Experiment Solder Volume (mᶾ) 0.6856809 0.713686 0.7115409 0.7084583 0.7103076 0.770773118 Error (%) 11.0 7.4 7.7 8.1 7.8 - Supplementary Files 3QuestionsandAnswers.docx Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-982900","acceptedTermsAndConditions":true,"allowDirectSubmit":true,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":57008979,"identity":"7a2f2b71-437d-46a9-8c8b-950ddad94224","order_by":0,"name":"Mohammad Hafifi Hafiz Ishak","email":"","orcid":"","institution":"Universiti Sains Malaysia","correspondingAuthor":false,"prefix":"","firstName":"Mohammad","middleName":"Hafifi Hafiz","lastName":"Ishak","suffix":""},{"id":57008980,"identity":"5868b5e0-d320-4ff1-9ad2-11cc1725dfb2","order_by":1,"name":"Mohd Syakirin Rusdi","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAAsUlEQVRIiWNgGAWjYHACZoYEBgkGftK1SDaQpAUEDA4Qq15+RvJjg4d7LPKMb6Q/3cCYc5iwFoMbacYJCc8kis1u5JjdYNxGjBaJBOMDCQckErfdyGEjTov8jPTPYC2bZ6Q/I04Lw40coMOAWjZIJBDrsDNvig1AWmaceWN2I3FbOhEOa0/fLPnjQF1ifzvQYR+3WRPhMIEEJE4CQzMRWvgPoHDriNAyCkbBKBgFIw0AACn2QDS9zNcVAAAAAElFTkSuQmCC","orcid":"https://orcid.org/0000-0001-8437-746X","institution":"Universiti Sains Malaysia","correspondingAuthor":true,"prefix":"","firstName":"Mohd","middleName":"Syakirin","lastName":"Rusdi","suffix":""},{"id":57008981,"identity":"4eff4206-0585-4bb4-bfbf-a47d6c38f54d","order_by":2,"name":"Mohd Zulkifly Abdullah","email":"","orcid":"","institution":"Universiti Sains Malaysia","correspondingAuthor":false,"prefix":"","firstName":"Mohd","middleName":"Zulkifly","lastName":"Abdullah","suffix":""},{"id":57008982,"identity":"61e7f3a7-ce51-4095-a7c4-536364e520c9","order_by":3,"name":"Mohd Sharizal Abdul Aziz","email":"","orcid":"","institution":"Universiti Sains Malaysia","correspondingAuthor":false,"prefix":"","firstName":"Mohd","middleName":"Sharizal Abdul","lastName":"Aziz","suffix":""},{"id":57008983,"identity":"85dbc0f8-9a56-4a0b-a157-eb86c4e810d6","order_by":4,"name":"Muhammad Khalil Abdullah","email":"","orcid":"","institution":"Universiti Sains Malaysia","correspondingAuthor":false,"prefix":"","firstName":"Muhammad","middleName":"Khalil","lastName":"Abdullah","suffix":""},{"id":57008984,"identity":"f5146493-f4f1-4345-9899-ee30e66ee861","order_by":5,"name":"Parimalam Rethinasamy","email":"","orcid":"","institution":"Jalan Hi-Tech 2/3 Phase I, Kulim Hi-Tech Park,09000 Kulim, Malaysia","correspondingAuthor":false,"prefix":"","firstName":"Parimalam","middleName":"","lastName":"Rethinasamy","suffix":""},{"id":57008985,"identity":"da8c72cc-7aa9-4a43-b662-a92256ae8a5b","order_by":6,"name":"Damian G. Santhanasamy","email":"","orcid":"","institution":"Indium Corporation of America, 29 Kian Teck Avenue, Singapore","correspondingAuthor":false,"prefix":"","firstName":"Damian","middleName":"G.","lastName":"Santhanasamy","suffix":""}],"badges":[],"createdAt":"2021-10-16 12:51:30","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-982900/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-982900/v1","draftVersion":[],"editorialEvents":[],"editorialNote":"","failedWorkflow":false,"files":[{"id":14639863,"identity":"7b34c9b8-2f5e-49a4-8cda-17416aba06f8","added_by":"auto","created_at":"2021-10-18 20:10:48","extension":"jpg","order_by":1,"title":"Figure 1","display":"","copyAsset":false,"role":"figure","size":35069,"visible":true,"origin":"","legend":"Solder Paste Stencil Printing Process","description":"","filename":"1.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/932b85c70076e0624647e391.jpg"},{"id":14639243,"identity":"1a20f34a-457f-4c63-98ec-b5c3f3f23ac1","added_by":"auto","created_at":"2021-10-18 20:07:48","extension":"jpg","order_by":2,"title":"Figure 2","display":"","copyAsset":false,"role":"figure","size":78583,"visible":true,"origin":"","legend":"Anton Parr Viscometer and Spindle ","description":"","filename":"2.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/4271bddcdc1c4a0e46a24714.jpg"},{"id":14639867,"identity":"ddc1cacb-63a1-4c90-adbb-73ac9951b07a","added_by":"auto","created_at":"2021-10-18 20:10:48","extension":"jpg","order_by":3,"title":"Figure 3","display":"","copyAsset":false,"role":"figure","size":37668,"visible":true,"origin":"","legend":"Rheology test schematic diagram","description":"","filename":"3.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/3ce0947ad98020c00af6d563.jpg"},{"id":14639868,"identity":"965fba6b-3f81-44d0-82da-7121a349c791","added_by":"auto","created_at":"2021-10-18 20:10:48","extension":"jpg","order_by":4,"title":"Figure 4","display":"","copyAsset":false,"role":"figure","size":90161,"visible":true,"origin":"","legend":"Mesh and Boundary conditions","description":"","filename":"4.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/16a8c6448fed464bd3399a57.jpg"},{"id":14639924,"identity":"1b44f60e-b832-44f0-b3f5-f6ff0b0ae6ae","added_by":"auto","created_at":"2021-10-18 20:13:48","extension":"jpg","order_by":5,"title":"Figure 5","display":"","copyAsset":false,"role":"figure","size":66000,"visible":true,"origin":"","legend":"Solder paste measurement using Koh Young 3D scanner and CFD simulation result for 1210 Resistor (2.54 mm × 1.016 mm)","description":"","filename":"5.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/dd6fd89dcb3d2d09dea6f683.jpg"},{"id":14639865,"identity":"e332fd66-a7c1-480d-8cca-12a4064f4b10","added_by":"auto","created_at":"2021-10-18 20:10:48","extension":"jpg","order_by":6,"title":"Figure 6","display":"","copyAsset":false,"role":"figure","size":58109,"visible":true,"origin":"","legend":"Viscosity versus shear rate at different spindle test","description":"","filename":"6.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/3403fa3335c8be2b56d17cd7.jpg"},{"id":14639869,"identity":"358ac14d-d545-4a36-b1bb-d69e4ac02e03","added_by":"auto","created_at":"2021-10-18 20:10:48","extension":"jpg","order_by":7,"title":"Figure 7","display":"","copyAsset":false,"role":"figure","size":56190,"visible":true,"origin":"","legend":"Solder paste volume at different squeegee speed.","description":"","filename":"7.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/f2a51519c83d5500ea06d0ba.jpg"},{"id":14639252,"identity":"cbe17393-8413-480f-ba8f-ce180759c806","added_by":"auto","created_at":"2021-10-18 20:07:48","extension":"jpg","order_by":8,"title":"Figure 8","display":"","copyAsset":false,"role":"figure","size":71911,"visible":true,"origin":"","legend":"Solder pastes volume difference in percentage at different squeegee speed","description":"","filename":"8.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/abe26c89a00622b2424b9efb.jpg"},{"id":14639246,"identity":"f62ff149-d448-4367-bbd3-482961ad4346","added_by":"auto","created_at":"2021-10-18 20:07:48","extension":"jpg","order_by":9,"title":"Figure 9","display":"","copyAsset":false,"role":"figure","size":66991,"visible":true,"origin":"","legend":"Solder paste volume at different aperture size","description":"","filename":"9.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/0547c3f1e2bc5a1375987d1f.jpg"},{"id":14639249,"identity":"eb84949f-7459-4b0e-a507-66f2286fb30a","added_by":"auto","created_at":"2021-10-18 20:07:48","extension":"jpg","order_by":10,"title":"Figure 10","display":"","copyAsset":false,"role":"figure","size":64494,"visible":true,"origin":"","legend":"Solder pastes volume difference in percentage at different aperture size","description":"","filename":"10.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/bacf2fa5ee782aff243edd00.jpg"},{"id":14639925,"identity":"a7e1bc66-25be-4e77-989d-e34b10f3025b","added_by":"auto","created_at":"2021-10-18 20:13:48","extension":"jpg","order_by":11,"title":"Figure 11","display":"","copyAsset":false,"role":"figure","size":57538,"visible":true,"origin":"","legend":"Solder pastes volume difference at different aperture size","description":"","filename":"11.jpg","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/12a6035232af20aa3dfdb659.jpg"},{"id":14639926,"identity":"73aae3f4-30c9-4b21-9304-686ecb75a343","added_by":"auto","created_at":"2021-10-18 20:13:54","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":870223,"visible":true,"origin":"","legend":"","description":"","filename":"ManuscriptEffectsofDifferentViscometerTestIJAMT.pdf","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1_covered.pdf"},{"id":14639250,"identity":"7d270035-de7b-4051-85e0-85db3a67a11d","added_by":"auto","created_at":"2021-10-18 20:07:48","extension":"docx","order_by":6,"title":"","display":"","copyAsset":false,"role":"supplement","size":21350,"visible":true,"origin":"","legend":"","description":"","filename":"3QuestionsandAnswers.docx","url":"https://assets-eu.researchsquare.com/files/rs-982900/v1/2733db8f6eaff431c5c5e825.docx"}],"financialInterests":"","formattedTitle":"Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation","fulltext":[{"header":"Full Text","content":"This preprint is available for \u003ca href='/article/rs-982900/latest.pdf' target='_blank'\u003edownload as a PDF\u003c/a\u003e."},{"header":"Tables","content":"\u003cp\u003e\u003cstrong\u003eTable 1: Spindle size and gap height\u003c/strong\u003e\u003c/p\u003e\n\u003ctable border=\"1\" cellpadding=\"0\" cellspacing=\"0\"\u003e\n \u003ctbody\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"31.29139072847682%\"\u003e\n \u003cp\u003eSpindle\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"35.43046357615894%\"\u003e\n \u003cp\u003eDiameter (mm)\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"33.27814569536424%\"\u003e\n \u003cp\u003eGap Height (mm)\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"31.29139072847682%\"\u003e\n \u003cp\u003eCone Plate 1.014\u0026deg;\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"35.43046357615894%\"\u003e\n \u003cp\u003e24.980\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"33.27814569536424%\"\u003e\n \u003cp\u003e0.051\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"31.29139072847682%\"\u003e\n \u003cp\u003eCone Plate 2.008\u0026deg;\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"35.43046357615894%\"\u003e\n \u003cp\u003e24.981\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"33.27814569536424%\"\u003e\n \u003cp\u003e0.104\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"31.29139072847682%\"\u003e\n \u003cp\u003eParallel Plate Gap A\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"35.43046357615894%\"\u003e\n \u003cp\u003e24.985\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"33.27814569536424%\"\u003e\n \u003cp\u003e0.250\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"31.29139072847682%\"\u003e\n \u003cp\u003eParallel Plate Gap B\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"35.43046357615894%\"\u003e\n \u003cp\u003e24.985\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"33.27814569536424%\"\u003e\n \u003cp\u003e0.500\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"31.29139072847682%\"\u003e\n \u003cp\u003eParallel Plate Gap C\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"35.43046357615894%\"\u003e\n \u003cp\u003e24.985\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"33.27814569536424%\"\u003e\n \u003cp\u003e0.750\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003c/tbody\u003e\n\u003c/table\u003e\n\u003cp\u003e\u0026nbsp;\u003c/p\u003e\n\u003cp\u003e\u003cstrong\u003eTable 2: Time Step study\u003c/strong\u003e\u003c/p\u003e\n\u003ctable border=\"1\" cellpadding=\"0\" cellspacing=\"0\"\u003e\n \u003ctbody\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"13.598673300165837%\"\u003e\n \u003cp\u003eCase\u0026nbsp;\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e1\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.930348258706468%\"\u003e\n \u003cp\u003e2\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.930348258706468%\"\u003e\n \u003cp\u003e3\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e4\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e5\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"16.25207296849088%\"\u003e\n \u003cp\u003e\u0026nbsp;\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"13.598673300165837%\"\u003e\n \u003cp\u003eTime step\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e0.01\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.930348258706468%\"\u003e\n \u003cp\u003e0.005\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.930348258706468%\"\u003e\n \u003cp\u003e0.001\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e0.0005\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e0.0001\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"16.25207296849088%\"\u003e\n \u003cp\u003eExperiment\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"13.598673300165837%\"\u003e\n \u003cp\u003eSolder Volume (mᶾ)\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e0.7008324\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.930348258706468%\"\u003e\n \u003cp\u003e0.7077731\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.930348258706468%\"\u003e\n \u003cp\u003e0.713686\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e0.7115767\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e0.6425067\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"16.25207296849088%\"\u003e\n \u003cp\u003e0.770773118\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"13.598673300165837%\"\u003e\n \u003cp\u003eError (%)\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e9.1\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.930348258706468%\"\u003e\n \u003cp\u003e8.2\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.930348258706468%\"\u003e\n \u003cp\u003e7.4\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e7.7\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.096185737976782%\"\u003e\n \u003cp\u003e16.6\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"16.25207296849088%\"\u003e\n \u003cp\u003e-\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003c/tbody\u003e\n\u003c/table\u003e\n\u003cp\u003e\u0026nbsp;\u003c/p\u003e\n\u003cp\u003e\u003cstrong\u003eTable 3: Grid Independence Study\u003c/strong\u003e\u003c/p\u003e\n\u003ctable border=\"1\" cellpadding=\"0\" cellspacing=\"0\"\u003e\n \u003ctbody\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"13.741721854304636%\"\u003e\n \u003cp\u003eCase\u0026nbsp;\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e1\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.741721854304636%\"\u003e\n \u003cp\u003e2\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e3\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e4\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e5\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"16.225165562913908%\"\u003e\n \u003cp\u003e\u0026nbsp;\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"13.741721854304636%\"\u003e\n \u003cp\u003eNo. Of Elements\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e1952\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.741721854304636%\"\u003e\n \u003cp\u003e2632\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e3712\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e5192\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e7072\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"16.225165562913908%\"\u003e\n \u003cp\u003eExperiment\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"13.741721854304636%\"\u003e\n \u003cp\u003eSolder Volume (mᶾ)\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e0.6856809\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.741721854304636%\"\u003e\n \u003cp\u003e0.713686\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e0.7115409\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e0.7084583\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e0.7103076\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"16.225165562913908%\"\u003e\n \u003cp\u003e0.770773118\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003ctr\u003e\n \u003ctd valign=\"top\" width=\"13.741721854304636%\"\u003e\n \u003cp\u003eError (%)\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e11.0\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"13.741721854304636%\"\u003e\n \u003cp\u003e7.4\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e7.7\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e8.1\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"14.072847682119205%\"\u003e\n \u003cp\u003e7.8\u003c/p\u003e\n \u003c/td\u003e\n \u003ctd valign=\"top\" width=\"16.225165562913908%\"\u003e\n \u003cp\u003e-\u003c/p\u003e\n \u003c/td\u003e\n \u003c/tr\u003e\n \u003c/tbody\u003e\n\u003c/table\u003e"}],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":false,"hideJournal":true,"highlight":"","institution":"","isAcceptedByJournal":false,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":false,"isPdf":false,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"researchsquare","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":true,"externalIdentity":"","sideBox":"","snPcode":"","submissionUrl":"/submission","title":"Research Square","twitterHandle":"researchsquare","acdcEnabled":true,"dfaEnabled":false,"editorialSystem":"","reportingPortfolio":"","inReviewEnabled":false,"inReviewRevisionsEnabled":true},"keywords":"SAC305, lead-free solder paste, Stencil Printing, Viscometer, SMT Simulation","lastPublishedDoi":"10.21203/rs.3.rs-982900/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-982900/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eThis study discusses the use of different spindle type for the testing of lead-free solder paste by using Computational Fluid Dynamics (CFD) simulation. The study focuses on measuring the volume of solder paste deposition on the solder pad. Parallel-plate (PP) and Cone-plate (CP) spindle were used with five different tests consist of different spindle type and setting. The Volume of Fluid (VOF) method was used for the simulation while Cross model was applied as viscosity model for the solder paste. SAC305 type 3 lead-free solder paste was used in this study as it is mostly popular used by the industries nowadays. The solder paste filled the volume under different squeegee speeds and aperture size was compared between experiments and simulations. For different squeegee speed, PP 0.5 mm gap obtained the lowest average discrepancy value between simulation and experimental results. At different aperture size, all test show similar trend line and about the same value of average discrepancy with CP1° while PP 0.5 mm gap showed the lowest average discrepancy. At small aperture volume, all tests performed shows similar value of filled volume except PP 0.5 mm which exhibit the lowest percentage difference when compared with the experimental values at a bigger aperture volume.\u0026nbsp;\u003c/p\u003e","manuscriptTitle":"Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation","msid":"","msnumber":"","nonDraftVersions":[{"code":1,"date":"2021-10-18 20:07:46","doi":"10.21203/rs.3.rs-982900/v1","editorialEvents":[{"type":"communityComments","content":0}],"status":"published","journal":{"display":true,"email":"[email protected]","identity":"researchsquare","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":true,"externalIdentity":"","sideBox":"","snPcode":"","submissionUrl":"/submission","title":"Research Square","twitterHandle":"researchsquare","acdcEnabled":true,"dfaEnabled":false,"editorialSystem":"","reportingPortfolio":"","inReviewEnabled":false,"inReviewRevisionsEnabled":true}}],"origin":"","ownerIdentity":"1c6437e3-ca69-4b2a-8be4-a14d7aba9f0b","owner":[],"postedDate":"October 18th, 2021","published":true,"recentEditorialEvents":[],"rejectedJournal":[],"revision":"","amendment":"","status":"posted","subjectAreas":[{"id":7940535,"name":"Biotechnology and Bioengineering"}],"tags":[],"updatedAt":"2021-10-30T15:23:06+00:00","versionOfRecord":[],"versionCreatedAt":"2021-10-18 20:07:46","video":"","vorDoi":"","vorDoiUrl":"","workflowStages":[]},"version":"v1","identity":"rs-982900","journalConfig":"researchsquare"},"__N_SSP":true},"page":"/article/[identity]/[[...version]]","query":{"redirect":"/article/rs-982900","identity":"rs-982900","version":["v1"]},"buildId":"J0_U0BvcaRcwD8yVFaRlm","isFallback":false,"isExperimentalCompile":false,"dynamicIds":[84888],"gssp":true,"scriptLoader":[]}

Text is read by the "Ask this paper" AI Q&A widget below. Extraction quality varies by source — PMC NXML preserves structure cleanly, OA-HTML may include some navigation residue, and OA-PDF can have broken hyphenation. The publisher copy (via DOI) is the canonical version.

My notes (saved in your browser only)

⚙ Ask this paper AI returns verbatim quotes from the full text · source: preprint-html ⓘ

Answers must be backed by verbatim quotes from this paper's full text. Hallucinated quotes are dropped automatically; if no verbatim passage answers the question, we say so. How this works

Citation neighborhood (no data yet)

We don't have any in-corpus citations linked to this paper yet. The paper's references may be in our DB but unresolved to ``paper_id`` (resolution happens at ingest when the cited DOI matches a row we already have). Run the cross-source citation reconcile pass to retry.

Source provenance

europepmc
last seen: 2026-05-19T01:45:01.086888+00:00
unpaywall
last seen: 2026-05-29T02:00:03.542394+00:00
License: CC-BY-4.0