A Study on Universal Factor Determining the Evolution of Surface Roughness During Electrochemical Polishing

A Study on Universal Factor Determining the Evolution of Surface Roughness During Electrochemical Polishing | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article A Study on Universal Factor Determining the Evolution of Surface Roughness During Electrochemical Polishing Jianwei Ji, Khan M. Ajmal, Zejin Zhan, Rong Yi, Hui Deng This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-1180131/v1 This work is licensed under a CC BY 4.0 License Status: Under Review Version 1 posted 5 You are reading this latest preprint version Abstract Electrochemical polishing (ECP) is widely used for scratch- and damage-free finishing of metal components. Though the polishing effect of ECP has been confirmed in many researches, the influence of polishing parameters on evolution of surface roughness is still ambiguous owing to the use of different ECP systems. In this paper, the universal factor determining the evolution of surface roughness during ECP is studied by theoretical analysis as well as experiments. Theoretical analysis based on viscous layer mechanism demonstrates that the material removal thickness is the key parameter governing the roughness evolution of the polished surface regardless of other parameters including the voltage, current and electrolyte concentration and so forth. A series of experiments were designed and carried out to verify the proposed hypothesis. Both the experimental results and already published researches proved the validity and universality of the newly developed hypothesis on surface roughness evolution. This work is of great significance for further understanding the finishing mechanism of ECP and process control for its practical applications. Industrial Engineering Mechanical Engineering Electrochemical polishing Tungsten Surface roughness Removed thickness Viscous layer. Full Text Cite Share Download PDF Status: Under Review Version 1 posted Editorial decision: Minor Revisions Needed 11 Mar, 2022 Reviews received at journal 21 Dec, 2021 Reviewers invited by journal 20 Dec, 2021 Editor assigned by journal 20 Dec, 2021 First submitted to journal 16 Dec, 2021 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-1180131","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":71531474,"identity":"8d5849fa-0612-4c67-8e59-8aa8299f907b","order_by":0,"name":"Jianwei Ji","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAAzElEQVRIiWNgGAWjYBACxmaGBIYPEDYbEDMTp4VxBpDBQ7QWEGDmIUkLczvDM2mbP4ft7dmbnz1gqLBObGA/e4CQw9Kkc9sOJ/bwHDM3YDiTntjAk5dAUMvt3IbDCTwSOWwSjEC9DRI8BoS1WAAdxiP/BqjlH7FaGNgOM/ZI8AC1NBCnJf1nb1t6Ys+ZNDOJhGPpxm08Ofi1GPafSTb48cfanr398DOJDzXWsv3sZwhoaeBJQPBATDa86oFAnoH9ACE1o2AUjIJRMNIBALynPzI4p4/QAAAAAElFTkSuQmCC","orcid":"","institution":"Southern University of Science and Technology","correspondingAuthor":true,"submittingAuthor":false,"prefix":"","firstName":"Jianwei","middleName":"","lastName":"Ji","suffix":""},{"id":71531475,"identity":"28449f28-2512-4542-94f2-f628767540d0","order_by":1,"name":"Khan M. 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