Scalable Edge Contacts to Two-dimensional Semiconductors

Scalable Edge Contacts to Two-dimensional Semiconductors | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Article Scalable Edge Contacts to Two-dimensional Semiconductors Saptarshi Das, Muhtasim Ul Karim Sadaf, Ziheng Chen, Lei Ding, and 14 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-8708358/v1 This work is licensed under a CC BY 4.0 License Status: Under Review Version 1 posted You are reading this latest preprint version Abstract Contact engineering for two-dimensional (2D) field effect transistors (FETs) has advanced rapidly, with near-quantum-limit contact resistances (R_C) now reported for top contacts formed by physical vapor deposition (PVD) techniques. However, top contacts are inherently scaling-unfriendly because they are limited by transfer-length (L_T). As contact length (L_C) shrinks below L_T, current crowding inflates R_C, constraining footprint scaling. Furthermore, this contact geometry is also ill-matched to stacked nanosheet and gate all around (GAA) transistor technology, which demands tier-addressable, minimal-footprint contacts, i.e., edge contacts. Early reports on edge contact to 2D materials involve PVD approaches with minimal control on the contact/2D interface. Here we introduce a scalable, chemistry-defined edge-contact platform based on atomic layer deposition (ALD) of metallic transition-metal chalcogenides, which exploits the intrinsic reactivity contrast between inert 2D basal planes and under-coordinated edges. Using ALD-grown TiS2 as a prototype, we form conformal edge contacts to wafer-scale monolayer MoS2, WS2, MoSe2 and WSe2, as well as to a multi-tier MoS2 nanosheet stack, illustrating natural compatibility with 2D GAA geometries. For TiS2–MoS2 edge contacts we obtain a contact resistance of ~130 kΩ·µm, consistent with a Schottky barrier of ~0.43 eV, and establish wafer-scale reproducibility through statistics on 100 n-type and 100 p-type devices. First-principles quantum-transport calculations both reproduce the measured barriers and identify alternative ALD-compatible metals that approach near-ohmic edge injection, while revealing that mode matching and edge termination are as critical as band alignment. Finally, complementary inverters assembled from MoS2/WSe2 edge-contacted FETs demonstrate functional logic with well-defined gain, noise margins and static power, positioning ALD-engineered edge contacts as a practical route to high-density 2D CMOS and 3D-integrated nanosheet technologies. Physical sciences/Materials science/Nanoscale materials/Two-dimensional materials Physical sciences/Materials science/Materials for devices/Electronic devices Full Text Additional Declarations There is NO Competing Interest. Cite Share Download PDF Status: Under Review Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-8708358","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Article","associatedPublications":[],"authors":[{"id":607550111,"identity":"2b45c28c-3c38-48fb-8370-a5bb7263aa0a","order_by":0,"name":"Saptarshi 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However, top contacts are inherently scaling-unfriendly because they are limited by transfer-length (L_T). As contact length (L_C) shrinks below L_T, current crowding inflates R_C, constraining footprint scaling. Furthermore, this contact geometry is also ill-matched to stacked nanosheet and gate all around (GAA) transistor technology, which demands tier-addressable, minimal-footprint contacts, i.e., edge contacts. Early reports on edge contact to 2D materials involve PVD approaches with minimal control on the contact/2D interface. Here we introduce a scalable, chemistry-defined edge-contact platform based on atomic layer deposition (ALD) of metallic transition-metal chalcogenides, which exploits the intrinsic reactivity contrast between inert 2D basal planes and under-coordinated edges. Using ALD-grown TiS2 as a prototype, we form conformal edge contacts to wafer-scale monolayer MoS2, WS2, MoSe2 and WSe2, as well as to a multi-tier MoS2 nanosheet stack, illustrating natural compatibility with 2D GAA geometries. For TiS2–MoS2 edge contacts we obtain a contact resistance of ~130 kΩ·µm, consistent with a Schottky barrier of ~0.43 eV, and establish wafer-scale reproducibility through statistics on 100 n-type and 100 p-type devices. First-principles quantum-transport calculations both reproduce the measured barriers and identify alternative ALD-compatible metals that approach near-ohmic edge injection, while revealing that mode matching and edge termination are as critical as band alignment. 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