Modeling and Investigation of Minimum Chip Thickness for Silicon Carbide during Quasi-intermittent Vibration Assisted Swing Cutting

Abstract In micromachining, the Quasi-intermittent Vibration-assisted Swing Cutting technology alleviates the residual height problem of vibration-assisted machining, and inherits the intermittent machining characteristics of Elliptical Vibration-assisted Cutting (EVC). The minimum chip thickness has a significant impact on cutting forces, tool wear, and process stability when working with difficult-to-machine materials. This study thoroughly examines the impact of cutting parameters and tool parameters on the quality of the workpiece during machining in order to better understand the time-varying characteristics of the QVASC machining process and the size effect on micro cutting of SiC crystal. This paper created the minimum chip thickness prediction model suited for QVASC machining process. The effects of variables like cutting speed and tool inclination on the minimum chip thickness were discussed as well as the scribing tests that were conducted on such challenging materials as SiC. The research findings show that: during the machining process, the critical undeformed chip thickness of silicon carbide decreases continuously as the cutting velocity sequentially increases (1.51 mm/min, 1.88 mm/min, 2.26 mm/min); under the down inclination angle (0–10°), the critical undeformed chip thickness also continuously decreases. Some conclusion can be drawn that cutting at too fast a velocity and reduces the thickness of the instantaneous undeformed chip, which is not conducive to ductile removal.