Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Article Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging Pengfei Bai, Huawei Wang, Xiaotong Zhang, He Cui, Yifan Tang, and 3 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-4365330/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 04 Jan, 2025 Read the published version in Communications Engineering → Version 1 posted You are reading this latest preprint version Abstract Conventional chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Some chip package structures with liquid cooling are developed, but at the same time, these will bring additional risks to running safety. Here we propose and fabricate a completely closed high-conducting heat chip package based on the passive phase change and the compatible material with the chip dies: chip on vapor chamber (CoVC), to realize the rapid diffusion of the heat of hot spots, so as to completely eliminate the energy consumption of the refrigeration which usually takes up the largest share in the power of the heat management. Multi-scale wicks and bionic vein structures are applied to CoVC. The multi-scale wick could increase the turning heat load of the CoVC from 20 W to 140 W, which was a 600% increase. The combination of bionic vein structure and CoVC has an increase of 164% in the heat transfer performance. The thermal resistance of the package was only a third of that traditional package. This means that the structure of CoVC has a good ability in thermal conducting and can reduce energy consumption for heat dissipation. Physical sciences/Energy science and technology/Thermoelectric devices and materials Physical sciences/Engineering/Electrical and electronic engineering Chip package Integrated cooling Vein bionics Phase change Thermal management Full Text Additional Declarations There is NO Competing Interest. Cite Share Download PDF Status: Published Journal Publication published 04 Jan, 2025 Read the published version in Communications Engineering → Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. We do this by developing innovative software and high quality services for the global research community. Our growing team is made up of researchers and industry professionals working together to solve the most critical problems facing scientific publishing. Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-4365330","acceptedTermsAndConditions":true,"allowDirectSubmit":false,"archivedVersions":[],"articleType":"Article","associatedPublications":[],"authors":[{"id":303733291,"identity":"dbce484a-edf6-423d-8179-59cb527a42c7","order_by":0,"name":"Pengfei Bai","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAAAx0lEQVRIiWNgGAWjYBACAwbGBoaKCiiPh2gtZ86QpgUIzraRosWc/XDbg4Pz6uTNJRIYH7xtY5A3J6TFsiex3eDgtsOGO2ckMBvObWMw3NlAyGEHEtukP247kGBwI4FNmreNIcHgACEt5x+2SRycUwfSwv6bOC03EoFaGpjBtjATpcVyxsN2gwPHDhtuOPOwWXLOOQnDDYS0mPOnP3twoKZO3uB48sEPb8ps5AnaAgRsUBoYpwwMEoTVI2kZBaNgFIyCUYADAABX00PapJ4MOQAAAABJRU5ErkJggg==","orcid":"","institution":"South China Normal University","correspondingAuthor":true,"prefix":"","firstName":"Pengfei","middleName":"","lastName":"Bai","suffix":""},{"id":303733292,"identity":"36772d3a-e08d-471a-b809-14fe1f61ea3c","order_by":1,"name":"Huawei Wang","email":"","orcid":"","institution":"South China Normal University","correspondingAuthor":false,"prefix":"","firstName":"Huawei","middleName":"","lastName":"Wang","suffix":""},{"id":303733293,"identity":"3b48dd8d-84fe-4830-b7bb-a7b31be68d5e","order_by":2,"name":"Xiaotong Zhang","email":"","orcid":"","institution":"South China Normal University","correspondingAuthor":false,"prefix":"","firstName":"Xiaotong","middleName":"","lastName":"Zhang","suffix":""},{"id":303733294,"identity":"15f6eaec-1224-4ccc-86d6-a2d68fe7201e","order_by":3,"name":"He Cui","email":"","orcid":"","institution":"South China Normal University","correspondingAuthor":false,"prefix":"","firstName":"He","middleName":"","lastName":"Cui","suffix":""},{"id":303733295,"identity":"bc783ac4-449c-4eac-ae34-f5a7705b53a9","order_by":4,"name":"Yifan Tang","email":"","orcid":"","institution":"South China Normal University","correspondingAuthor":false,"prefix":"","firstName":"Yifan","middleName":"","lastName":"Tang","suffix":""},{"id":303733296,"identity":"0c5a8703-6f9c-4edb-8d7b-74fae079b125","order_by":5,"name":"Shaoyu Liang","email":"","orcid":"","institution":"South China Normal University","correspondingAuthor":false,"prefix":"","firstName":"Shaoyu","middleName":"","lastName":"Liang","suffix":""},{"id":303733297,"identity":"3ecebd94-a72a-43c3-b63b-ee1c3bea05f5","order_by":6,"name":"Shixiao Li","email":"","orcid":"","institution":"South China Normal University","correspondingAuthor":false,"prefix":"","firstName":"Shixiao","middleName":"","lastName":"Li","suffix":""},{"id":303733298,"identity":"01507ad9-18e1-4ce7-931d-8a62f513fe5a","order_by":7,"name":"Guofu Zhou","email":"","orcid":"","institution":"South China Normal University","correspondingAuthor":false,"prefix":"","firstName":"Guofu","middleName":"","lastName":"Zhou","suffix":""}],"badges":[],"createdAt":"2024-05-03 17:10:31","currentVersionCode":1,"declarations":"","doi":"10.21203/rs.3.rs-4365330/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-4365330/v1","draftVersion":[],"editorialEvents":[{"content":"https://doi.org/10.1038/s44172-024-00338-6","type":"published","date":"2025-01-04T05:00:00+00:00"}],"editorialNote":"","failedWorkflow":false,"files":[{"id":72985882,"identity":"97a52f74-4151-4bcf-874b-bf531384b814","added_by":"auto","created_at":"2025-01-05 08:06:33","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":1817380,"visible":true,"origin":"","legend":"","description":"","filename":"RevisedManuscriptcleanversion.pdf","url":"https://assets-eu.researchsquare.com/files/rs-4365330/v1_covered_c896b80b-6887-4be1-912e-111b80046706.pdf"}],"financialInterests":"There is \u003cb\u003eNO\u003c/b\u003e Competing Interest.","formattedTitle":"Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":false,"hideJournal":false,"highlight":"","institution":"","isAcceptedByJournal":true,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":false,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"nature-portfolio","isNatureJournal":true,"hasQc":false,"allowDirectSubmit":false,"externalIdentity":"","sideBox":"","snPcode":"","submissionUrl":"","title":"Nature Portfolio","twitterHandle":"","acdcEnabled":false,"dfaEnabled":false,"editorialSystem":"ejp","reportingPortfolio":"","inReviewEnabled":true,"inReviewRevisionsEnabled":false},"keywords":"Chip package, Integrated cooling, Vein bionics, Phase change, Thermal management","lastPublishedDoi":"10.21203/rs.3.rs-4365330/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-4365330/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"Conventional chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Some chip package structures with liquid cooling are developed, but at the same time, these will bring additional risks to running safety. Here we propose and fabricate a completely closed high-conducting heat chip package based on the passive phase change and the compatible material with the chip dies: chip on vapor chamber (CoVC), to realize the rapid diffusion of the heat of hot spots, so as to completely eliminate the energy consumption of the refrigeration which usually takes up the largest share in the power of the heat management. Multi-scale wicks and bionic vein structures are applied to CoVC. The multi-scale wick could increase the turning heat load of the CoVC from 20 W to 140 W, which was a 600% increase. The combination of bionic vein structure and CoVC has an increase of 164% in the heat transfer performance. The thermal resistance of the package was only a third of that traditional package. This means that the structure of CoVC has a good ability in thermal conducting and can reduce energy consumption for heat dissipation.","manuscriptTitle":"Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging","msid":"","msnumber":"","nonDraftVersions":[{"code":1,"date":"2024-05-29 03:24:52","doi":"10.21203/rs.3.rs-4365330/v1","editorialEvents":[],"status":"published","journal":{"display":true,"email":"[email protected]","identity":"communications-engineering","isNatureJournal":true,"hasQc":false,"allowDirectSubmit":false,"externalIdentity":"commseng","sideBox":"Learn more about [Communications Engineering](http://link.springer.com/journal/44172)","snPcode":"44172","submissionUrl":"https://mts-commseng.nature.com/cgi-bin/main.plex","title":"Communications Engineering","twitterHandle":"@commseng","acdcEnabled":true,"dfaEnabled":true,"editorialSystem":"ejp","reportingPortfolio":"Springer Hybrid","inReviewEnabled":true,"inReviewRevisionsEnabled":true}}],"origin":"","ownerIdentity":"6ca5911c-52f9-41cf-9ead-6f3a9488fb2a","owner":[],"postedDate":"May 29th, 2024","published":true,"recentEditorialEvents":[],"rejectedJournal":[],"revision":"","amendment":"","status":"published-in-journal","subjectAreas":[{"id":32066823,"name":"Physical sciences/Energy science and technology/Thermoelectric devices and materials"},{"id":32066824,"name":"Physical sciences/Engineering/Electrical and electronic engineering"}],"tags":[],"updatedAt":"2025-01-05T08:06:27+00:00","versionOfRecord":{"articleIdentity":"rs-4365330","link":"https://doi.org/10.1038/s44172-024-00338-6","journal":{"identity":"communications-engineering","isVorOnly":false,"title":"Communications Engineering"},"publishedOn":"2025-01-04 05:00:00","publishedOnDateReadable":"January 4th, 2025"},"versionCreatedAt":"2024-05-29 03:24:52","video":"","vorDoi":"10.1038/s44172-024-00338-6","vorDoiUrl":"https://doi.org/10.1038/s44172-024-00338-6","workflowStages":[]},"version":"v1","identity":"rs-4365330","journalConfig":"researchsquare"},"__N_SSP":true},"page":"/article/[identity]/[[...version]]","query":{"redirect":"/article/rs-4365330","identity":"rs-4365330","version":["v1"]},"buildId":"8U1c8b4HqxoKbykW_rLl7","isFallback":false,"isExperimentalCompile":false,"dynamicIds":[84888],"gssp":true,"scriptLoader":[]}