Temperature characteristics of MEMS Pressure Sensor with High Proof Pressure for Adjustable Ranges

Temperature characteristics of MEMS Pressure Sensor with High Proof Pressure for Adjustable Ranges | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Research Article Temperature characteristics of MEMS Pressure Sensor with High Proof Pressure for Adjustable Ranges Mikhail Basov This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-8978664/v1 This work is licensed under a CC BY 4.0 License Status: Posted Version 1 posted You are reading this latest preprint version Abstract Temperature characteristics are one of the key parameters determining the performance of MEMS pressure sensor under specific operating conditions. This research demonstrates a new microassembly design for differential pressure sensor with adjustable ranges of 10…60 kPa. A distinguishing feature of this microassembly is its use of stops for pressure sensor chip with sensitivity of S = 0.61 ± 0.15 mV/V/kPa. Developed pressure sensor enables to withstand proof pressure of 1.5 MPa. The proposed base geometry of the microassembly significantly reduces the impact of residual mechanical stresses (RMS) by all mechanical connections of pressure sensor chip, which is subjected to thermocycling and barocycling. It has been proven that it is possible to achieve errors in the temperature hysteresis of the zero signal (THZ) of less than 0.25%/FS in a wide temperature range from -65⁰С to +85⁰С, despite the requirement of top mechanical stop (as an additional source of RMS), which is only necessary to increase the overload capacity of pressure sensor pressure sensor microassembly design high proof pressure temperature characteristics residual mechanical stress Full Text Additional Declarations The authors declare no competing interests. Cite Share Download PDF Status: Posted Version 1 posted You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. As a division of Research Square Company, we’re committed to making research communication faster, fairer, and more useful. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {"props":{"pageProps":{"initialData":{"identity":"rs-8978664","acceptedTermsAndConditions":true,"allowDirectSubmit":true,"archivedVersions":[],"articleType":"Research Article","associatedPublications":[],"authors":[{"id":597597542,"identity":"aa6bbdf5-952a-4317-88ca-970ce46584da","order_by":0,"name":"Mikhail Basov","email":"data:image/png;base64,iVBORw0KGgoAAAANSUhEUgAAAZAAAAAyAQMAAABI0h/eAAAABlBMVEX///8AAABVwtN+AAAACXBIWXMAAA7EAAAOxAGVKw4bAAABAUlEQVRIiWNgGAWjYJCCAyDCAMK2AWLGxgOkaEkDaWkgqIUBScthhCG4AL90+8XDBRU2+ebsxx8+5s05b7e2/TDQlhqbaFxaJOecKTg840ya5c6eHGNj3m23k7edSQRqOZaW24DLPTdyEg7zth02MDiQwyY5E6jF7ABQC2PDYZxa7MFa/v03MDj//BlQy7lks/MP8WsxkEg/cJi34YCBwY0EM4mP2w7Ymd0gYIvEjRyGwzzHkg0sZ7wxNvi4LTnB7AbQlgQ8fuGfkf74M0+NnYE5f/rDB4nb7OzNzgMZH2pscGphYOAxQOEmglUm4FQOAuwPULj2eBWPglEwCkbBiAQAth9on7sH41IAAAAASUVORK5CYII=","orcid":"https://orcid.org/0000-0003-0798-4500","institution":"FSUE VNIIA","correspondingAuthor":true,"prefix":"","firstName":"Mikhail","middleName":"","lastName":"Basov","suffix":""}],"badges":[],"createdAt":"2026-02-26 14:12:56","currentVersionCode":1,"declarations":{"humanSubjects":false,"vertebrateSubjects":false,"conflictsOfInterestStatement":false,"humanSubjectEthicalGuidelines":false,"humanSubjectConsent":false,"humanSubjectClinicalTrial":false,"humanSubjectCaseReport":false,"vertebrateSubjectEthicalGuidelines":false},"doi":"10.21203/rs.3.rs-8978664/v1","doiUrl":"https://doi.org/10.21203/rs.3.rs-8978664/v1","draftVersion":[],"editorialEvents":[],"editorialNote":"","failedWorkflow":false,"files":[{"id":104398165,"identity":"3715273d-e435-4b29-8146-b151fe7734b9","added_by":"auto","created_at":"2026-03-11 12:00:06","extension":"pdf","order_by":1,"title":"","display":"","copyAsset":false,"role":"manuscript-pdf","size":600152,"visible":true,"origin":"","legend":"","description":"","filename":"Preprint.TemperaturecharacteristicsofMEMSPressureSensorwithHighProofPressureforAdjustableRangesupto1060kPa.pdf","url":"https://assets-eu.researchsquare.com/files/rs-8978664/v1_covered_992b1de7-8465-41d1-9854-93a220d52f6d.pdf"}],"financialInterests":"The authors declare no competing interests.","formattedTitle":"\u003cp\u003eTemperature characteristics of MEMS Pressure Sensor with High Proof Pressure for Adjustable Ranges\u003c/p\u003e","fulltext":[],"fulltextSource":"","fullText":"","funders":[],"hasAdminPriorityOnWorkflow":false,"hasManuscriptDocX":false,"hasOptedInToPreprint":true,"hasPassedJournalQc":"","hasAnyPriority":true,"hideJournal":true,"highlight":"","institution":"","isAcceptedByJournal":false,"isAuthorSuppliedPdf":true,"isDeskRejected":"","isHiddenFromSearch":false,"isInQc":false,"isInWorkflow":false,"isPdf":true,"isPdfUpToDate":true,"isWithdrawnOrRetracted":false,"journal":{"display":true,"email":"[email protected]","identity":"researchsquare","isNatureJournal":false,"hasQc":true,"allowDirectSubmit":true,"externalIdentity":"","sideBox":"","snPcode":"","submissionUrl":"/submission","title":"Research Square","twitterHandle":"researchsquare","acdcEnabled":true,"dfaEnabled":false,"editorialSystem":"","reportingPortfolio":"","inReviewEnabled":false,"inReviewRevisionsEnabled":true},"keywords":"pressure sensor, microassembly design, high proof pressure, temperature characteristics, residual mechanical stress","lastPublishedDoi":"10.21203/rs.3.rs-8978664/v1","lastPublishedDoiUrl":"https://doi.org/10.21203/rs.3.rs-8978664/v1","license":{"name":"CC BY 4.0","url":"https://creativecommons.org/licenses/by/4.0/"},"manuscriptAbstract":"\u003cp\u003eTemperature characteristics are one of the key parameters determining the performance of MEMS pressure sensor under specific operating conditions. 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