A Compact Parallel Dispensing Machine of High-viscous Adhesive Based on Electrostatic-induced Mechanism

Abstract Adhesive bonding process has been widely applied in the assembly of micro-electro-mechanical system products, in which the efficient micro-dispensing technique of high-viscous liquid is important for the bonding performance. In this paper, we propose a compact and portable machine for the parallel dispensing task of high-viscous adhesive based on electrostatic-induced mechanism. The designed flexible probe array can reduce the impact of height difference Δh on transferring stage to thereby improve the dispensing consistency. With the developed machine, both parallel and serial dispensing modes are built up with replaceable dispensing head to satisfy various requirements. The dispensing efficiency is increased by 91.44% via parallel dispensing mode, comparing with previous single-probe mode. In addition, smart patterning with Mean square deviation σd less than 0.026 mm is achieved with both the configurable probe-status and the replaceable dispensing head. We believe this machine can be used efficiently and smartly in the adhesive bonding process.