Numerical Simulation on Thermoelectric Cooling of Core Power Devices in Air Conditioning

Air conditioners are indispensable necessities in daily life and industrial production. However, the heat generation of their internal core power components can limit their performance release. In this work, we explore the application of thermoelectric coolers (TECs) in the field of power device heat dissipation through finite element simulation. First, we geometrically modeled the structure and typical operating conditions of core power devices in air conditioners. We compared the temperature fields in air cooling and TEC active cooling modes for high power consumption power devices in a 319 K operating environment. The simulation results show that in the single air cooling mode, the maximum temperature of the 173.8 W power device reaches 394.4 K and the average temperature reaches 373.9 K, which exceeds its rated operating temperature of 368.1 K. However, after adding TEC, the maximum temperature of the power device drops to 331.8 K at an operating current of 7.5 A and the average temperature of the device is 326.5 K. It indicates that TEC active cooling has a significant effect on the temperature control of the power device. At the same time, we also studied the effect of TEC working current on the temperature control effect of power devices. For TEC, there is a minimum working current of 5 A; when it is less than 5 A, TEC has no cooling effect; the cooling effect of TEC increases with an increase in working current. When the TEC working current is 10 A, the average temperature of the power device can be reduced to 292.9 K. This study has made a meaningful exploration of the application of TEC in chip temperature control and heat dissipation, providing a new solution for chip thermal management and accurate temperature control.