{"paper_id":"2ccc47bb-2de8-4db4-b43c-31dfe61ebcd3","body_text":"FFF print defect characterization through in-situ electrical resistance monitoring | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Article FFF print defect characterization through in-situ electrical resistance monitoring Heime Jonkers, Alexander Dijkshoorn, Stefano Stramigioli, Gijs Krijnen This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-3956508/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 24 May, 2024 Read the published version in Scientific Reports → Version 1 posted 9 You are reading this latest preprint version Abstract Fused Filament Fabrication is a popular fabrication technique. Currently there is a need for in-situ monitoring modalities to gather real-time information on prints, both for quality control and closed-loop control. Despite current advancements, effective and affordable in-situ monitoring techniques for non-destructive defect detection of voids and bonding quality are still limited. This work demonstrates in-situ monitoring of Fused Filament Fabrication through electrical resistance measurements as an alternative to thermal and optical methods. A new, easy-to-implement setup is demonstrated which measures the electrical resistance of a conductively doped filament between the nozzle and single or multi-electrodes on the bed. Defects can be located in an unprecedented way with the use of encoded axes in combination with the observed resistance variations throughout the part. A model of the anisotropic electrical conduction is used to interpret the measurements, which matches well with the data. Warping, inter-layer adhesion, under-extrusion and overhang sagging print defects can be observed in the measurements of parts with a complex geometry, which would be difficult to measure otherwise. Altogether in-situ electrical resistance monitoring offers a tool for optimising prints by online studying the influence of the print parameters for quality assessment and it opens up possibilities for closed-loop control. Physical sciences/Engineering Physical sciences/Engineering/Electrical and electronic engineering Full Text Additional Declarations No competing interests reported. Supplementary Files SupplementaryVideoS1.mp4 SupplementaryVideoS2.mp4 SupplementaryVideoS3.mp4 SupplementaryVideoS4.mp4 SupplementaryVideoS5.mp4 SupplementaryVideoS6.mp4 SupplementaryMaterialFFFprintdefectcharacterizationthroughinsituelectricalresistancemeasurement.pdf Cite Share Download PDF Status: Published Journal Publication published 24 May, 2024 Read the published version in Scientific Reports → Version 1 posted Editorial decision: Revision requested 19 Mar, 2024 Reviews received at journal 08 Mar, 2024 Reviewers agreed at journal 01 Mar, 2024 Reviewers agreed at journal 01 Mar, 2024 Reviewers invited by journal 01 Mar, 2024 Editor assigned by journal 01 Mar, 2024 Editor invited by journal 27 Feb, 2024 Submission checks completed at journal 27 Feb, 2024 First submitted to journal 14 Feb, 2024 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. 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