{"paper_id":"235aaff0-4c4b-4e9e-a2a2-45aa3899b80f","body_text":"Time and temperature dependence of residual stress evolution and protrusion behavior in through-glass vias | Research Square window.SnipcartSettings = { analytics: { enabled: false } }; (function() { var accessVector = localStorage.getItem('access_vector') || ''; window.dataLayer = window.dataLayer || []; if (accessVector) { window.dataLayer.push({ user: { profile: { profileInfo: { snid: accessVector } } } }); } })(); (function(w,d,s,l,i){w[l]=w[l]||[];w[l].push({'gtm.start':new Date().getTime(),event:'gtm.js'});var f=d.getElementsByTagName(s)[0],j=d.createElement(s),dl=l!='dataLayer'?'&l='+l:'';j.async=true;j.src='https://www.googletagmanager.com/gtm.js?id='+i+dl;f.parentNode.insertBefore(j,f);})(window,document,'script','dataLayer','GTM-K279D39R'); Browse Preprints In Review Journals COVID-19 Preprints AJE Video Bytes Research Tools Research Promotion AJE Professional Editing AJE Rubriq About Preprint Platform In Review Editorial Policies Our Team Advisory Board Help Center Sign In Submit a Preprint Cite Share Download PDF Article Time and temperature dependence of residual stress evolution and protrusion behavior in through-glass vias Xiaofeng Yang, Haozhong Wang, Bingxu Ma, Peijiang Liu, Wanchun Tian, and 3 more This is a preprint; it has not been peer reviewed by a journal. https://doi.org/ 10.21203/rs.3.rs-7322629/v1 This work is licensed under a CC BY 4.0 License Status: Published Journal Publication published 06 Feb, 2026 Read the published version in Microsystems & Nanoengineering → Version 1 posted 11 You are reading this latest preprint version Abstract Through glass via (TGV) has emerged as a critical solution for next-generation packaging platforms owing to its low dielectric loss, superior coefficient of thermal expansion (CTE) compatibility. Previous studies shows that low thermal conductivity of TGV could lead to thermo-mechanical failures. However, current research on failure behavior of TGV induced by thermal stress structures remains relatively limited. This paper investigates the effects of annealing conditions on residual stress distribution and Cu protrusion behavior in TGV. The evolution of residual stress in glass substrates under different annealing temperatures and annealing periods was analyzed by nanoindentation, and the corresponding morphological changes of Cu protrusions were characterized by atomic force microscopy (AFM). It is found that annealing helps reduce residual stress on the glass substrate, but prolonged annealing can lead to the generation of residual tensile stress, thereby causing glass cracking; Cu protrusion height increases with annealing period but shows a decreasing growth rate. A creep rate model is established, achieving 87.32% prediction accuracy for TGV creep behavior. These results provide theoretical guidance for TGV reliability assessment and thermal optimization design. Physical sciences/Engineering/Electrical and electronic engineering Physical sciences/Physics Full Text Additional Declarations There is no conflict of interest Cite Share Download PDF Status: Published Journal Publication published 06 Feb, 2026 Read the published version in Microsystems & Nanoengineering → Version 1 posted Editorial decision: revise 14 Sep, 2025 Review # 3 received at journal 11 Sep, 2025 Review # 2 received at journal 02 Sep, 2025 Reviewer # 3 agreed at journal 29 Aug, 2025 Review # 1 received at journal 20 Aug, 2025 Reviewer # 2 agreed at journal 14 Aug, 2025 Reviewer # 1 agreed at journal 11 Aug, 2025 Reviewers invited by journal 11 Aug, 2025 Submission checks completed at journal 09 Aug, 2025 Editor assigned by journal 07 Aug, 2025 First submitted to journal 07 Aug, 2025 You are reading this latest preprint version Research Square lets you share your work early, gain feedback from the community, and start making changes to your manuscript prior to peer review in a journal. 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Also discoverable on Platform About Our Team In Review Editorial Policies Advisory Board Help Center Resources Author Services Accessibility API Access RSS feed Manage Cookie Preferences © Research Square 2026 | ISSN 2693-5015 (online) Privacy Policy Terms of Service Do Not Sell My Personal Information {\"props\":{\"pageProps\":{\"initialData\":{\"identity\":\"rs-7322629\",\"acceptedTermsAndConditions\":true,\"allowDirectSubmit\":false,\"archivedVersions\":[],\"articleType\":\"Article\",\"associatedPublications\":[],\"authors\":[{\"id\":498561014,\"identity\":\"0e638b5c-b503-479a-90c7-53e029d5d004\",\"order_by\":0,\"name\":\"Xiaofeng 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